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PRO3C (MALAYSIA) SDN. BHD. is seeking a detail-oriented finance professional to manage AP, AR, and fixed assets within a manufacturing context. You will verify supplier invoices, process payments, reconcile statements, and assist with month-end close. Fresh graduates are welcome, with Mandarin a plus for HQ communication.
The role covers AR duties, SST submissions, and ad-hoc financial tasks while ensuring compliance with internal controls and ERP systems.
Receive, review, and verify supplier invoices and supporting documents.
Match invoices with purchase orders and delivery receipts.
Process and schedule supplier payments.
Reconcile supplier statements and resolve discrepancies.
Maintain accurate and up-to-date accounts payable records in the accounting system.
Support month-end closing activities, including accruals and account reconciliations.
Ensure compliance with internal controls, tax regulations, and company policies.
Respond to supplier inquiries and coordinate with procurement and other departments. OR
Fresh graduates are welcome to apply.
Regional subsidiary of PRIME Technology (Guangzhou) Inc., a technology company with over 30 years of expertise in high-precision electronic design, research, and manufacturing. Company are doing manufacturing for PCBA and micro-assembly electronics solutions. To support products and solutions for industries such as automotive, aviation, industrial, maritime, communication, medical, and consumer electronics. Aligns with cutting-edge production practices and technology development in semiconductor packaging and electronics solutions.
Regional subsidiary of PRIME Technology (Guangzhou) Inc., a technology company with over 30 years of expertise in high-precision electronic design, research, and manufacturing. Company are doing manufacturing for PCBA and micro-assembly electronics solutions. To support products and solutions for industries such as automotive, aviation, industrial, maritime, communication, medical, and consumer electronics. Aligns with cutting-edge production practices and technology development in semiconductor packaging and electronics solutions.