Account Manager (Power Packaging - Semiconductor)
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd. is seeking an Account Manager for its Wide Band Gap (WBG) portfolio, responsible for key-account management and proactive new-customer development across SiC and GaN power devices. The role requires strong technical knowledge, strategic selling, and frequent travel to global customers.
You will analyze sales data, build customer relationships, and collaborate with pre-sales and engineering to translate design-wins into revenue. Based in Malaysia with travel required.
Qualifications
- Proven track record in semiconductor sales or key-account management.
- Experience selling wide-bandgap (SiC/GaN) products is a plus.
- Willingness to travel frequently to global customers.
Responsibilities
- Own and grow the WBG sales portfolio with a mix of key-account management and new-customer development.
- Develop pricing and strategies to meet growth targets and profitability.
- Coordinate with pre-sales and technical teams to align product offerings with customer roadmaps.
- Prepare reports by collecting, analyzing and summarizing sales data.
Skills
Education
Tools
Job description
Carsem's Wide Band Gap (WBG) business is one of the Group's newest and fastest-growing operations, delivering advanced assembly, packaging and test solutions for Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices across automotive, AI, renewable-energy and communications end markets. The portfolio is in a high-growth phase with a strong focus on new‑customer development.
As Account Manager, you will own the WBG sales portfolio in an execution-focused role — combining key-account management with active new‑customer development and opportunity conversion. It's a great opportunity to grow your career within one of the industry's fastest-growing power‑semiconductor businesses.
You will act as the key point of contact between Carsem and its WBG customers. You bring thorough product and packaging knowledge and oversee product and service sales for the SiC / GaN portfolio, working with customers to identify their needs and preparing reports by collecting, analysing and summarising sales information.
You will maintain and deepen customer relationships to strategically place new products and drive long‑term growth, and develop new customers to build the pipeline. This is a fast‑paced role with frequent travel, suited to someone knowledgeable of the wide‑bandgap / power‑semiconductor domain.
Develop pricing approaches to support WBG sales and market‑growth strategies.
Contribute to strategic sales targets, markets and product/service offerings, expected volume and profits.
Analyse sales and customer data to identify market trends and estimate demand; share market feedback.
Create lead‑generation plans to ensure a substantive opportunity pipeline.
Identify, qualify and win new customers to grow the WBG pipeline.
Present new products, packages and services to new and existing clients; convert design-wins into revenue.
Work with pre‑sales and technical teams to align capability with customer roadmaps.
Develop sales proposals, quotes and bid / RFP documents; plan the approach for each opportunity.
Negotiate specific terms of product/service offerings; analyse motivations and concerns of decision-makers.
Coordinate with stakeholders to finalise contract terms, commercial requirements and NDAs.
Engage clients regularly to uncover current and potential needs; build and strengthen relationships.
Conduct customer review meetings and prepare commercial and technical presentation material.
Respond to customer sales, logistics and technical enquiries; support RFPs; represent Carsem at seminars and roadshows.
Degree or equivalent; relevant semiconductor sales experience may substitute
Solid semiconductor / OSAT sales or key-account experience with a track record of delivery.
Familiarity with power semiconductors and/or wide-bandgap (SiC / GaN) technology, packaging and test — or the drive to ramp quickly.
A hunter's mindset for new‑customer development and design-win conversion.
Strong commercial, negotiation and customer-relationship skills.
Willingness to be based in Malaysia and travel frequently to global customers.
- Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
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