Senior NPI & End of Line (EOL) Engineer
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd is seeking an engineering professional to review RFQs and TGA documents for EOL-related requirements and coordinate cross-functional teams across PM, NPI, and production to ensure on-time project execution.
The role focuses on EOL activities, BOM and process flow reviews, and preparation of validation reports to support mass production and yield targets.
Qualifications
- Bachelor's degree in engineering or related discipline.
- Experience in semiconductor manufacturing is an advantage.
- Strong data analysis and interpretation skills.
Responsibilities
- Review RFQs prepared by the PM team for EOL-related technical requirements.
- Review TGA documents for EOL-related requirements.
- Participate in customer conference calls and provide project updates and action item status.
- Coordinate with internal cross-functional teams, suppliers, and customers on EOL-related matters.
- Support EOL activities including BOM, Plan ID, and process flow review and approval.
- Prepare Engineering Validation and Qualification reports for NPI and newly developed packages.
- Monitor and improve processes to achieve minimum 98.5% yield targets.
- Work with NPI, Package Development, and EOL Technician teams for timely releases.
- Collaborate with PM, Planning, QA, Production, Process, Maintenance, and Tooling teams to ensure schedules.
Education
Tools
Job description
Review RFQs prepared by the Project Management (PM) team for EOL-related technical requirements.
Review TGA documents for EOL-related requirements.
Participate in customer conference calls and provide project updates and action item status.
Coordinate with internal cross-functional teams, suppliers, and customers on EOL-related matters.
Support EOL activities including:
BOM, Plan ID, and process flow review and approval.
Package packing specification updates and tool buy-off (Pick & Place, Laser Mark, Mold, etc.).
Support New Product Introduction (NPI), process transfer, and mass production activities.
Prepare Engineering Validation and Qualification reports for NPI and newly developed packages.
Monitor and improve processes to ensure NPI and new development projects achieve minimum 98.5% yield targets.
Work closely with FOL NPI, Package Development, and EOL Technician teams to ensure smooth project execution and timely release.
Collaborate with PM, Planning, QA, Production, Process, Maintenance, and Tooling teams to ensure builds are completed on schedule.
Data Analysis & Interpretation
Review RFQs prepared by the Project Management (PM) team for EOL-related technical requirements.
Review TGA documents for EOL-related requirements.
Participate in customer conference calls and provide project updates and action item status.
Coordinate with internal cross-functional teams, suppliers, and customers on EOL-related matters.
Support EOL activities including:
BOM, Plan ID, and process flow review and approval.
Package packing specification updates and tool buy-off (Pick & Place, Laser Mark, Mold, etc.).
Support New Product Introduction (NPI), process transfer, and mass production activities.
Prepare Engineering Validation and Qualification reports for NPI and newly developed packages.
Monitor and improve processes to ensure NPI and new development projects achieve minimum 98.5% yield targets.
Work closely with FOL NPI, Package Development, and EOL Technician teams to ensure smooth project execution and timely release.
Collaborate with PM, Planning, QA, Production, Process, Maintenance, and Tooling teams to ensure builds are completed on schedule.
Knowledge of EOL processes such as Mold, Laser Mark, Singulation, and Pick & Place is an advantage.
Ability to collect, organize, analyze, and interpret data to support decision-making.
Ability to investigate product and process issues and drive corrective actions.
Working knowledge of SPC, DOE, FMEA, Six Sigma, and other statistical tools.
Drive ramp-to-yield performance and yield entitlement targets.
Support continuous improvement initiatives to enhance cycle time, yield, and product quality.
Bachelor's Degree in Electrical, Electronics, Mechatronics, Manufacturing, Mechanical Engineering, or a related discipline.
Experience in semiconductor manufacturing, assembly, test, NPI, product engineering, process engineering, or manufacturing engineering is an advantage.
Consumer Electronics Manufacturing More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits
- Medical Education support Dental Parking Medical for immediate family members, car subsidy
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