Section Head, NPI Planner
Carsem (M) Sdn. Bhd
Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.
Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd in Ipoh, Malaysia, is seeking a Production Planning professional to develop, manage, and maintain detailed production and lot schedules supporting NPI and mass production.
You will coordinate NPI builds, work with Engineering, Production, Procurement and Supply Chain to ensure material readiness, capacity, and on-time execution, monitor status, and drive continuous improvement.
Qualifications
- Bachelor's Degree or Diploma in Engineering, Supply Chain Management, Operations Management, or a related field.
- Minimum 3-5 years of experience in semiconductor planning, NPI planning, production planning, or manufacturing planning.
- Good understanding of semiconductor manufacturing processes, production workflows, and documentation control.
- Experience in production scheduling, capacity planning, material planning, and delivery management.
- Proficient in Microsoft Excel, ERP systems, MES systems, or other planning tools.
- Strong analytical, problem-solving, and organizational skills.
- Ability to manage multiple priorities in a fast‑paced manufacturing environment.
- Effective communication and stakeholder management skills.
- Experience supporting NPI, qualification builds, and product ramp‑up activities is highly preferred.
Responsibilities
- Develop, manage, and maintain detailed production and lot schedules to support NPI and mass production activities.
- Coordinate NPI builds including ES, Qualification, Ramp-Up, and SOD to ensure readiness and on‑time execution.
- Work closely with Engineering, Production, Procurement, and Supply Chain teams to ensure material, capacity, and technical readiness.
- Monitor production status, WIP, output, and cycle time to ensure delivery commitments are achieved.
- Track NPI milestones and drive timely closure of action items to meet project timelines.
- Identify and mitigate risks related to material shortages, capacity constraints, production delays, and schedule changes.
- Prepare and communicate production schedules, build plans, project updates, and delivery commitments to internal stakeholders and customers.
- Maintain accurate planning data, BOMs, work instructions, and related documentation within ERP/MES systems.
- Support product ramp‑up activities and transition from NPI to mass production.
- Drive continuous improvement initiatives to improve planning efficiency, communication, and operational performance.
Skills
Education
Tools
Job description
Develop, manage, and maintain detailed production and lot schedules to support NPI and mass production activities.
Coordinate NPI builds including ES, Qualification, Ramp-Up, and SOD to ensure readiness and on‑time execution.
Work closely with Engineering, Production, Procurement, and Supply Chain teams to ensure material, capacity, and technical readiness.
Monitor production status, WIP, output, and cycle time to ensure delivery commitments are achieved.
Track NPI milestones and drive timely closure of action items to meet project timelines.
Identify and mitigate risks related to material shortages, capacity constraints, production delays, and schedule changes.
Prepare and communicate production schedules, build plans, project updates, and delivery commitments to internal stakeholders and customers.
Maintain accurate planning data, BOMs, work instructions, and related documentation within ERP/MES systems.
Support product ramp‑up activities and transition from NPI to mass production.
Drive continuous improvement initiatives to improve planning efficiency, communication, and operational performance.
Job Requirements
Bachelor's Degree or Diploma in Engineering, Supply Chain Management, Operations Management, or a related field.
Minimum 3-5 years of experience in semiconductor planning, NPI planning, production planning, or manufacturing planning.
Good understanding of semiconductor manufacturing processes, production workflows, and documentation control.
Experience in production scheduling, capacity planning, material planning, and delivery management.
Proficient in Microsoft Excel, ERP systems, MES systems, or other planning tools.
Strong analytical, problem-solving, and organizational skills.
Ability to manage multiple priorities in a fast‑paced manufacturing environment.
Effective communication and stakeholder management skills.
Experience supporting NPI, qualification builds, and product ramp‑up activities is highly preferred.
- Medical Education support
- Dental Parking
- Medical for immediate family members, car subsidy
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
