Lead Analog Mixed-Signal IC Design – Hybrid Milan

IC Resources

Milano

Ibrido

EUR 90.000 - 140.000

Tempo pieno

4 giorni fa
Candidati tra i primi
Generatore di candidature

Una candidatura apposita per questa offerta — un curriculum e una lettera di presentazione personalizzati, perfettamente in linea con l'annuncio.

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Vantaggi offerti da questo lavoro

Hybrid work model

Descrizione del lavoro

IC Resources in Milan seeks an experienced Analog Mixed-Signal IC Design Lead to own silicon development from concept to production. This hybrid role involves hands-on leadership of architecture, verification, and bring-up across full design flows.

You will guide analog and mixed-signal teams through multiple tape-outs, coordinate with foundries and EDA partners, and ensure performance, reliability and manufacturability of next-generation IC products.

Competenze

  • Strong background in analog and mixed-signal IC design.

Mansioni

  • Lead analog and mixed-signal IC design from architecture through to tape out.
  • Own silicon development programmes, including verification, sign-off, bring-up and characterisation.
  • Perform schematic design, simulation, layout reviews and design optimisation.
  • Work with internal teams, foundries, EDA partners and external suppliers.
  • Support decisions around performance, reliability, manufacturability and production readiness.
  • Provide technical guidance while remaining hands on with design activities.

Conoscenze

Analog IC design
Mixed-signal design
Technical leadership
Schematic & layout
Silicon validation
Fabless environment
Tape-out leadership

Strumenti

Cadence
SPICE simulators

Descrizione del lavoro

IC Resources in Milan seeks an experienced Analog Mixed-Signal IC Design Lead to own silicon development from concept to production. This hybrid role involves hands-on leadership of architecture, verification, and bring-up across full design flows.

You will guide analog and mixed-signal teams through multiple tape-outs, coordinate with foundries and EDA partners, and ensure performance, reliability and manufacturability of next-generation IC products.

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