Simulation Engineer - Electronics Cooling.

3D Engineering Automation LLP; Bengaluru; On-site; INR 300,000 - 500,000; Full time

Job summary

3D Engineering Automation LLP is seeking a Simulation Engineer specialized in Electronics Cooling in Bengaluru, India. The ideal candidate will focus on thermal analysis and cooling design of PCBs and electronic assemblies using ANSYS Icepak. Responsibilities include performing thermal simulations, optimizing cooling solutions, and collaborating with multi-disciplinary teams. Candidates should have a Bachelor's or Master's in Thermal Engineering and some experience with PCB thermal simulation. The position is full-time and offers opportunities for professional growth.

Qualifications

• 0-1 years of hands-on experience in PCB or electronics thermal simulation.
• Strong understanding of heat transfer principles (conduction, convection, radiation).
• Ability to interpret thermal constraints, junction temperatures, and reliability limits.

Responsibilities

• Perform steady-state and transient thermal simulations of PCBs and systems.
• Analyze conduction, convection, and radiation heat-transfer mechanisms.
• Document simulation assumptions and results.

Skills

Understanding of heat transfer principles

ANSYS Icepak proficiency

Problem-solving skills

Experience with PCB power maps

Education

Bachelor’s or Master’s degree in Thermal Engineering

Tools

ANSYS Icepak

Job description

Simulation Engineer - Electronics Cooling.

0-1 yrs

Full-Time

Job Title

Simulation Engineer - PCB Thermal Analysis - Electronics Cooling.

Job Summary

An experienced PCB Thermal Simulation Engineer is required to join our Ansys Product Team. The candidate will be responsible for thermal analysis and cooling design of PCBs, electronic assemblies, and enclosures using ANSYS Icepak/ AEDT Icepak, supporting design validation, optimization, and reliability of high-power and high-density electronic systems.

Key Responsibilities

• Perform steady-state and transient thermal simulations of PCBs, electronic components, and systems using ANSYS Icepak.
• Model heat sources such as ICs, processors, power devices, VRMs, and passive components based on power dissipation profiles.
• Create and validate PCB stack-up thermal models, including copper layers, vias, thermal pads, and material properties.
• Analyze conduction, convection, and radiation heat-transfer mechanisms in electronic assemblies.
• Evaluate and optimize cooling solutions: heat sinks, fans, airflow paths, vents, heat spreaders, and thermal interface materials (TIMs).
• Perform airflow and CFD analysis inside enclosures to identify hot spots and improve thermal performance.
• Conduct parametric studies and design-of-experiments (DOE) to optimize thermal design parameters.
• Correlate simulation results with thermal measurements (thermocouples, IR camera, power tests).
• Work closely with PCB, mechanical, and hardware teams to recommend thermal design improvements (component placement, copper balancing, airflow routing).
• Document simulation assumptions, boundary conditions, results, and actionable thermal mitigation guidelines.
• Support pre-layout and post-layout thermal analysis workflows.
• Ensure designs meet reliability, derating, and temperature limits as per industry standards.

Required Qualifications & Skills

• Bachelor’s or Master’s degree in Thermal Engineering or related field.
• 0-1 years of hands‑on experience in PCB or electronics thermal simulation.
• Strong understanding of heat transfer principles (conduction, convection, radiation).
• Proficiency with ANSYS Icepak (PCB thermal modeling, airflow, enclosure analysis).
• Experience working with PCB power maps and component power dissipation data.
• Ability to interpret thermal constraints, junction temperatures, and reliability limits.
• Familiarity with material properties, TIMs, and PCB thermal vias.
• Strong problem‑solving skills and ability to generate clear technical reports.

Preferred

• Experience integrating ECAD (PCB) data into Icepak (from Allegro, Altium, ODB++).
• Knowledge of electro‑thermal co‑simulation (thermal impact on SI/PI or power devices).
• Familiarity with EMI/EMC or SI/PI effects influenced by temperature.
• Experience with server, telecom, automotive, aerospace, or defence electronics.
• Basic scripting (Python) for automation and post‑processing is a plus.
• Experience collaborating in multi‑disciplinary design reviews.