Manager PCB Simulation

Gi Group; Bengaluru; On-site; INR 4,000,000 - 6,000,000; Full time

Job summary

Gi Group Bengaluru seeks a senior leader to drive PCB simulation for high‑speed boards, covering SI, PI, EMC/RFI and thermal analyses.

You will mentor a multidisciplinary team, shape simulation strategy, and review designs with global hardware and manufacturing partners to ensure first‑time‑right prototypes and scalable production.

Qualifications

• A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree is preferred.
• 15 years of extensive hands‑on experience in high-speed PCB simulation with a track record of delivering complex projects.
• 5–7 years of leadership or management experience.
• Strong grasp of PCB layout, libraries, schematics, routing and manufacturability.

Responsibilities

• Lead, mentor, and develop simulation team for SI, PI, EMC, RFI, and thermal incidents.
• Define and implement simulation methodologies and best practices for PCB projects.
• Provide technical oversight on SI for high-speed interfaces (DDR, PCIe) and PI/EMC.
• Conduct design reviews and provide strategic recommendations to optimize performance.
• Collaborate with global hardware, mechanical, and manufacturing teams.
• Drive innovation in PCB simulation processes and stay current with standards.

Skills

High-speed PCB simulation

Team leadership

PCB design basics

DFM knowledge

Thermal analysis

SI/PI/EMC/RFI

Education

Bachelor’s degree in Electrical or Electronics Engineering

Master’s degree preferred

Tools

Ansys SIwave/HFSS

Keysight PathWave

Cadence Sigrity

Siemens HyperLyx

CST Studio Suite

EMC/ICEPAK tools

Job description

Job Location - Bangalore (Work from Office)

Roles and Responsibilities

• Team leadership and management: Lead, mentor, and develop simulation team for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Manage workload, project allocation, and career growth for team members.
• Simulation strategy and roadmap: Define and implement simulation methodologies and best practices for accuracy, efficiency, optimizations and recommendations across all PCB simulation projects.
• Technical oversight and guidance: Provide technical direction on simulation tasks and result interpretations on signal integrity (SI) for high-speed interfaces like DDR and PCIe, power integrity (PI) for efficient power delivery, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal management.
• Design review and validation: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
• Cross-functional collaboration: Work closely with global hardware, mechanical, and manufacturing teams to translate product requirements into viable PCB designs and simulations. Communicate with cross-functional teams, customers and suppliers on simulation results and design risks.
• Continuous improvement: Drive innovation and improvement in the PCB simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
• Project and resource management: Independent management of multiple complex PCB simulation projects simultaneously, ensuring projects meet deadlines, budget requirements, and performance targets.
• Quality Management: lead and drive accuracy in simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, cross-correlation of simulation results with experimental results, and design optimizations for first time right manufacturability (prototypes and mass production).

Qualifications and skills

Education

• A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred.

Experience

• Around 15 years of extensive hands‑on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.
• 5-7 years of progressive leadership or management experience.
• Breadth and depth on high performance team building, employee goal setting and performance management, talent hiring and nurturing, capability development, project acquisition, customer discussion, alignment with business objective and goals, QCD (quality, cost and delivery), strategy and execution, employee engagement, empowerment and delegation, competency and knowledge management.
• Proficient and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.

Technical Skills

• Expertise with simulation tools for high-speed electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
• Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
• Good understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
• Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).