Staff - PCB Simulation Engineer

TE Connectivity; Bengaluru; On-site; INR 1,500,000 - 2,000,000; Full time

Job summary

A leading technology firm is seeking a STAFF - PCB Simulation Engineer in Bengaluru, India. This senior role involves developing innovative solutions for high-speed PCB simulations and providing technical guidance. The ideal candidate will have 8-10 years of experience in PCB simulation, leveraging advanced simulation tools and industry standards, to deliver high-performance, reliable products. Candidates must have a background in electrical engineering and demonstrate strong problem-solving capabilities.

Qualifications

• Around 8~10 years of extensive hands-on experience in high-speed PCB simulation.
• Deep functional knowledge on printed circuit board layout and manufacturability.
• Expertise with simulation tools for high-speed electrical and thermal analysis.

Responsibilities

• Develop new ideas, methods, and solutions for signal integrity and thermal incidents.
• Establish simulation methods and best practices.
• Provide direction to simulation engineers on tasks and interpretations.

Skills

High-speed PCB simulation

Signal integrity (SI)

Power integrity (PI)

Electromagnetic compatibility (EMC)

Thermal management

Ansys tools

Cadence Allegro

Education

Bachelor’s degree in electrical or electronics engineering

Master’s degree in a related field

Tools

Ansys SIwave/HFSS

Keysight Pathwave ADS

Cadence Allegro

Siemens HyperLyx

Altium Designer

Job description

Job Title: STAFF - PCB Simulation Engineer

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

PCB Staff Simulation Engineer is a senior technical leader in high speed PCB simulation team in Digital Data Networks (DDN) business of TE Connectivity, responsible for developing new ideas, methods and solutions, providing technical guidance, directions and measurable inputs to dept objectives and goals supporting business strategies, and serving as an advisor for technical roadmaps of the function involving electrical and thermal simulations for ensuring high standards for performance, reliability, and manufacturability before prototyping and mass production at competitive cost. Staff Engineer is expected to be influential leaders, even without formal management authority, possessing strong technical expertise, problem solving skills, and the ability to drive innovation and ensure product quality. They network with customers/external partners/suppliers/universities/professional associations to acquire new functions, knowledge and expertise. They perform work without appreciable direction. They drive results primarily through collaboration and influence and exercise considerable latitude in determining objectives and approaches to assignment.

Job Requirements

• Education:
  • A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred. Consistent performance throughout entire academics (e.g. STD-X onwards).
• Experience:
  • Around 8~10 years of extensive hands‑on experience in high‐speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.
  • Deep functional and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.
• Technical Skills:
  • Expertise with simulation tools for high‑speed electrical and thermal analysis: Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
  • Deep understanding of high‑speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
  • Strong understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
  • Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Job Responsibilities

• Develop solutions: develop new ideas, methods, and solutions for signal integrity, power integrity, EMC, RFI, and thermal incidents; manage workload, project allocation, and career growth for team members.
• Establish simulation methods and best practices for accuracy, efficiency, optimisation and recommendations across all PCB simulation projects.
• Provide technical guidance: offer direction to simulation engineers on simulation tasks and result interpretations for SI, PI, EMC, RFI, and thermal management; provide training and mentorship to less‑experienced employees.
• Review and validate simulation inputs, results and analysis to provide strategic recommendations to optimise PCB performance and reliability.
• Collaborate cross‑functionally: work with hardware, mechanical and manufacturing teams to translate product requirements into viable PCB simulations; explain results and risks to stakeholders.
• Drive continuous improvement: innovate and improve the PCB simulation process, stay current with emerging technologies, design standards and simulation tools.
• Ensure quality metrics: lead on accuracy, design of experiments, plausibility checks, sensitivity studies, cross‑correlation with experimental results and designs for first‑time right manufacturability.

Competencies

Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

Job Locations:

Job Country: India

Travel Required: Less than 10%

Requisition ID: 141502

Workplace Type: External Careers Page: Engineering & Technology