Senior STA Engineer

LeadSoc Technologies Pvt Ltd

Bengaluru

On-site

INR 4,000,000 - 7,000,000

Full time

14 days+

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Job summary

LeadSoc Technologies Pvt Ltd is seeking a Senior Full-Chip Static Timing Analysis (STA) Engineer to own timing signoff and convergence for large high-performance SoCs across advanced nodes. You will partner with PD, RTL, DFT, Synthesis, Library and CAD teams to achieve first-pass silicon success.

Responsibilities include owning full-chip STA signoff across modes and MCMM scenarios, driving timing closure for setup/hold/clock gating, performing advanced timing analyses, and developing SDC

Qualifications

  • 7–10 years of hands-on experience in Full-Chip STA and Timing Signoff for complex ASIC/SoC designs.

Responsibilities

  • Own full-chip STA signoff across all functional modes, PVT corners, and MCMM scenarios.
  • Drive timing closure for setup, hold, recovery, removal, minimum pulse width, clock gating, and asynchronous timing checks.
  • Perform advanced timing analysis using OCV, AOCV, POCV, LVF, CRPR, and variation-aware signoff methodologies.
  • Lead full-chip timing convergence by analysing critical timing paths and driving closure with PD, RTL, and Architecture teams.
  • Debug complex timing issues related to clock architecture, long interconnects, hierarchical interfaces, timing exceptions, and generated clocks.
  • Perform Signal Integrity (SI), Crosstalk, Noise, and Delta Delay analysis and drive clean timing signoff.
  • Develop, validate, and maintain SDC constraints, ensuring complete timing coverage across the chip.
  • Execute and validate timing ECOs while balancing performance, power, and area (PPA).
  • Correlate timing across Synthesis, Place & Route, and Signoff environments to ensure silicon accuracy.
  • Drive hierarchical and top-level timing integration, interface timing closure, and partition-level signoff.
  • Work closely with Physical Design teams during CTS, routing, post-route optimization, and final signoff.
  • Develop automation using Tcl, Python, or Perl to improve signoff productivity, regression, QoR analysis, and reporting.
  • Support tapeout readiness through comprehensive timing signoff reviews and cross-functional design closure.

Skills

Full-Chip STA
Timing signoff
Critical path analysis
Clock distribution
Scripting (Tcl, Python, Perl)
Synthesis/PD/RTL collaboration
Noise/Signal Integrity (SI)

Education

B.E./B.Tech/M.E./M.Tech in Electronics or Electrical Engineering

Tools

ICC2/Fusion Compiler
Cadence Innovus
SDF/LEF/DEF

Job description

We are looking for a Senior Full-Chip Static Timing Analysis (STA) Engineer to own timing signoff and closure for large, high-performance SoCs across advanced technology nodes. You will be responsible for driving full-chip timing convergence from post-CTS through tapeout, partnering with Physical Design, RTL, DFT, Synthesis, Library, and CAD teams to achieve first-pass silicon success.

Responsibilities
  • Own full-chip STA signoff across all functional modes, PVT corners, and MCMM scenarios.
  • Drive timing closure for setup, hold, recovery, removal, minimum pulse width, clock gating, and asynchronous timing checks.
  • Perform advanced timing analysis using OCV, AOCV, POCV, LVF, CRPR, and variation-aware signoff methodologies.
  • Lead full-chip timing convergence by analysing critical timing paths and driving closure with PD, RTL, and Architecture teams.
  • Debug complex timing issues related to clock architecture, long interconnects, hierarchical interfaces, timing exceptions, and generated clocks.
  • Perform Signal Integrity (SI), Crosstalk, Noise, and Delta Delay analysis and drive clean timing signoff.
  • Develop, validate, and maintain SDC constraints, ensuring complete timing coverage across the chip.
  • Execute and validate timing ECOs while balancing performance, power, and area (PPA).
  • Correlate timing across Synthesis, Place & Route, and Signoff environments to ensure silicon accuracy.
  • Drive hierarchical and top-level timing integration, interface timing closure, and partition-level signoff.
  • Work closely with Physical Design teams during CTS, routing, post-route optimization, and final signoff.
  • Develop automation using Tcl, Python, or Perl to improve signoff productivity, regression, QoR analysis, and reporting.
  • Support tapeout readiness through comprehensive timing signoff reviews and cross-functional design closure.
Required Qualifications
  • B.E./B.Tech/M.E./M.Tech in Electronics, Electrical Engineering, or related discipline.
  • 7–10 years of hands-on experience in Full-Chip STA and Timing Signoff for complex ASIC/SoC designs.
  • Proven experience closing timing on large-scale SoCs through multiple successful tapeouts.
Technical Expertise
Timing Signoff
  • Full-chip timing signoff
  • MCMM timing analysis
  • Setup/Hold closure
  • OCV, AOCV, POCV, LVF
  • Timing ECO implementation
  • MMMC methodology
  • SDC development and constraint validation
Physical Design Awareness
  • CTS optimization
  • Clock distribution and skew management
  • Post-route timing optimization
  • RC extraction and parasitic analysis
  • LEF/DEF, SPEF, SDF
  • Strong understanding of ICC2/Fusion Compiler or Cadence Innovus flows
Scripting & Automation
  • Tcl
  • Python
  • Perl
  • Shell scripting
  • Advanced FinFET nodes (7nm, 5nm, 4nm, 3nm and below)
  • High-performance CPU, GPU, AI Accelerator, Networking, or Datacenter SoCs
Preferred Qualifications
  • Expertise in full-chip timing architecture, partition integration, and top-level signoff methodologies.
  • Experience driving timing closure across 100M+ instance designs.
  • Strong understanding of low-power timing (UPF/CPF), hierarchical STA, and timing correlation with silicon.
  • Proven ability to drive cross-functional timing closure with minimal supervision in a fast-paced product development environment.
What You'll Bring
  • Deep expertise in full-chip timing signoff and advanced STA methodologies.
  • Strong analytical and debugging skills with a data-driven approach to timing closure.
  • Ownership mindset with the ability to lead timing closure for complex SoCs from implementation through tapeout.
  • Passion for building industry-leading silicon with uncompromising quality and performance.
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