Senior Engineer UPD Laser Marking and Singulation

Infineon Technologies AG; Malacca; On-site; INR 1,500,000 - 2,100,000; Full time

Job summary

Infineon Technologies AG is seeking a Senior Engineer to lead package singulation and laser marking development for high-volume semiconductor manufacturing. You will drive process development, qualification, and industrialization, while collaborating with suppliers and cross-functional teams to ensure cost-effective, scalable solutions.

You will provide technical leadership, influence the technology roadmap, and deliver process improvements across multiple projects, contributing to manufacturing

Qualifications

• Minimum 10+ years experience in semiconductor backend assembly and package development.
• Direct experience in package singulation & laser marking process development.
• Experience with Tape-based singulation, Tapeless singulation, and laser marking processes.
• Experience with high-volume semiconductor manufacturing environments.
• Strong technical leadership and problem-solving skills.

Responsibilities

• Lead development of next-generation package singulation and laser marking solutions.
• Drive process qualification and industrialization to support manufacturing targets.
• Develop and maintain Process Specifications, PFMEA, DFMEA, and related documents.
• Collaborate with suppliers for tooling, machines, and materials qualification.
• Provide technical guidance to engineers and project teams across projects.
• Benchmark industry practices to identify improvements and competitive advantages.

Skills

Package singulation

Laser marking

Semiconductor packaging

Process development

Industrialization

Yield improvement

Technology roadmap

Technical leadership

Stakeholder management

Education

Master's or Bachelor's in Engineering

Tools

Blade dicing equipment

Laser marking equipment

Tape-based tooling

Job description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Engineer UPD Laser Marking and Singulation, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?Your roleKey responsibilities in your new roleIn this role, you strive to serve as the primary technical expert in package singulation technology, driving the development of next-generation semiconductor packaging solutions that are high-performing, cost-effective, and scalable for manufacturing.Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturabilityDrive qualification and implement for Tape-based singulation processes, Tapeless singulation solutions, Laser marking & singulation technologies, and Hybrid singulation approachesResponsible or support for technical handshake and knowledge transfer to OperationsGenerate and update relevant documents, (e.g. Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR)Support prototype and development samples buildEvaluate emerging singulation technologies and establish technology readiness for industrial deploymentProvide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap for development projects)Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projectsIdentify and develop new Process technology and improve Process capability to meet new requirements from Business divisionsBenchmark industry best practices and identify opportunities for competitive advantageProvide technical guidance/buddy to other engineers and project teamYour profileQualifications and skills to help you succeedYou strive to leverage deep expertise in package singulation, laser marking, and semiconductor package development to drive innovative, scalable, and cost-effective manufacturing solutions while supporting high-volume production environments. You demonstrate strong technical leadership, strategic thinking, and problem-solving capabilities, influencing stakeholders and advancing process industrialization, yield improvement, and technology roadmap execution across diverse singulation technologies.Masters/Bachelor's Degree in Engineering or relevant course with a minimum 10+ years experience in semiconductor backend assembly and package developmentMinimum 5+ years direct experience in package singulation & laser marking process developmentProven hands-on expertise in Tape-based singulation, Tapeless singulation, Laser marking and singulationExperience supporting high-volume semiconductor manufacturing environmentsDemonstrated track record in process development, industrialization, and yield improvementExperience with technical competencies for different singulation technologies: Blade dicing and saw singulation, Tape-based package singulation, Tapeless package handling and singulation, UV and IR laser processes, Stealth and advanced laser dicing technologies as well as Multi-package and panel-level singulation strategiesExperience working with major singulation equipment suppliers and laser technology providers is an added advantageStrong technical leadership and influence without direct authorityGood in strategic thinking and technology roadmap planningExcellent problem-solving and analytical skillsStrong stakeholder management and communication capabilities#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.Learn more about our various contact channels and about Diversity & Inclusion at Infineon.