Senior Engineer

Infineon Technologies AG; Malacca; On-site; INR 1,200,000 - 1,800,000; Full time

Job summary

Infineon Technologies AG seeks a Senior Engineer to lead package singulation technology development, including tape-based, tapeless, and laser singulation. You will drive process development, qualification, and documentation for scalable manufacturing, collaborating with Operations and suppliers to optimize yield and cost efficiency.

Applicants should have 10+ years in semiconductor backend assembly and package development, with hands-on experience across multiple singulation technologies and a

Qualifications

• Minimum 10+ years in semiconductor backend assembly and package development.
• 5+ years direct experience in package singulation process development.
• Hands-on expertise in Tape-based, Tapeless, and Laser singulation processes.
• Experience supporting high-volume semiconductor manufacturing environments.
• Strong technical leadership and ability to influence stakeholders.

Responsibilities

• Perform process development activities: parameter scouting, optimization, verification, and process freeze.
• Drive qualification and implementation for Tape-based, Tapeless, Laser, and Hybrid singulation.
• Provide technical guidance and knowledge transfer to Operations.
• Generate and update Process Specification, PFMEA, DFMEA, and other related documents.
• Evaluate emerging singulation technologies and assess readiness for industrial deployment.

Skills

Package singulation

Laser singulation

Process development

Industrialization

Stakeholder management

Education

Bachelor's/Master's in Engineering

Job description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Engineer, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?Your roleKey responsibilities in your new roleIn this role, you strive to serve as the primary technical expert in package singulation technology, driving the development of next-generation semiconductor packaging solutions that are high-performing, cost-effective, and scalable for manufacturing.Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturabilityDrive qualification and implement for Tape-based singulation processes, Tapeless singulation solutions, Laser singulation technologies, and Hybrid singulation approachesResponsible or support for technical handshake and knowledge transfer to OperationsGenerate and update relevant documents, (e.g. Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR)Support prototype and development samples buildEvaluate emerging singulation technologies and establish technology readiness for industrial deploymentProvide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap for development projects)Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projectsIdentify and develop new Process technology and improve Process capability to meet new requirements from Business divisionsBenchmark industry best practices and identify opportunities for competitive advantageProvide technical guidance/buddy to other engineers and project teamYour profileQualifications and skills to help you succeedYou strive to leverage deep expertise in package singulation, laser singulation, and semiconductor package development to drive innovative, scalable, and cost-effective manufacturing solutions while supporting high-volume production environments. You demonstrate strong technical leadership, strategic thinking, and problem-solving capabilities, influencing stakeholders and advancing process industrialization, yield improvement, and technology roadmap execution across diverse singulation technologies.Masters/Bachelor's Degree in Engineering or relevant course with a minimum 10+ years experience in semiconductor backend assembly and package developmentMinimum 5+ years direct experience in package singulation process developmentProven hands-on expertise in Tape-based singulation, Tapeless singulation, and Laser singulationExperience supporting high-volume semiconductor manufacturing environmentsDemonstrated track record in process development, industrialization, and yield improvement.Experience with technical competencies for different singulation technologies: Blade dicing and saw singulation, Tape-based package singulation, Tapeless package handling and singulation, UV and IR laser singulation processes, Stealth and advanced laser dicing technologies, as well as Multi-package and panel-level singulation strategiesExperience working with major singulation equipment suppliers and laser technology providers is an added advantageStrong technical leadership and influence without direct authorityGood in strategic thinking and technology roadmap planningExcellent problem-solving and analytical skillsStrong stakeholder management and communication capabilities#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.Learn more about our various contact channels and about Diversity & Inclusion at Infineon.