Senior Engineer Unit Process Development Singulations

Infineon Technologies AG; Malacca; On-site; INR 3,000,000 - 5,400,000; Full time

Job summary

Infineon Technologies AG in India is seeking a Senior Engineer Unit Process Development Singulations to lead advanced process development in packaging. You will scout, optimize, verify, and freeze processes to meet targets in timeline, quality, cost, and manufacturability.

You will drive qualification of tape-based, tapeless, laser, and hybrid singulation; support prototypes, document processes (PFMEA, DFMEA, PDR), work with suppliers, mentor engineers, and guide technology roadmaps for scalable

Qualifications

• Proven hands-on experience in packaging singulation processes.
• Experience with tape-based, tapeless and laser singulation.
• Strong background in process development and industrialization.

Responsibilities

• Perform process development activities including parameter scouting, optimization, verification and process freeze.
• Drive qualification and implementation of various singulation technologies (tape-based, tapeless, laser, hybrid).
• Support prototype builds and documentation (Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR).
• Liaise with suppliers to drive tooling and equipment verification for development projects.
• Provide technical guidance and mentorship to engineers and project teams.

Skills

Tape-based singulation

Tapeless singulation

Laser singulation

Process development

High-volume manufacturing

Mentorship

Job description

#WeAreIn for jobs that impact everyone's life.What if your ideas could change the way the world connects, powers up, or thinks?As a Senior Engineer Unit Process Development Singulations in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.Are you in?Your roleKey responsibilities in your new rolePerform process development activities, including process parameter scouting, optimization, verification, and process freeze, to meet project targets in timeline, quality, cost competitiveness, and manufacturability.Drive qualification and implementation of:Tape-based singulation processesTapeless singulation solutionsLaser singulation technologiesHybrid singulation approachesSupport technical handover and knowledge transfer to Operations.Generate and maintain relevant documentation, including Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.Support prototype and development sample builds.Evaluate emerging singulation technologies and establish technology readiness for industrial deployment.Provide input and ensure accuracy of related documents, including Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance Checklist, and Unit Process Roadmap for development projects.Liaise with suppliers to drive continuous improvement and perform verification and qualification activities for new tooling, machines, and materials in development projects.Identify and develop new process technologies and improve process capability to meet business requirements.Benchmark industry best practices and identify opportunities for competitive advantage.Provide technical guidance and mentorship to engineers and project teams.Serve as the primary technical expert for package singulation technology, driving the development of high-performance, cost-effective, and scalable semiconductor package manufacturing solutions.Your profileQualifications and skills to help you succeedMinimum 10 years of experience in semiconductor backend assembly and package development.Minimum 5 years of direct experience in package singulation process development.Proven hands-on expertise in:Tape-based singulationTapeless singulationLaser singulationExperience supporting high-volume semiconductor manufacturing environments.Demonstrated track record in process development, industrialization, and yield improvement.Experience with the following singulation technologies:Blade dicing and saw singulationTape-based package singulationTapeless package handling and singulationUV and IR laser singulation processesStealth and advanced laser dicing technologiesMulti-package and panel-level singulation strategiesExperience working with major singulation equipment suppliers and laser technology providers is an added advantage.Strong technical leadership and ability to influence without direct authority.Strategic thinking and technology roadmap planning capabilities.Excellent problem-solving and analytical skills.Strong stakeholder management and communication skills.#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.Learn more about our various contact channels and about Diversity & Inclusion at Infineon.