Process Engineer

Kaynes Semicon; Sanand; On-site; INR 1,200,000 - 2,400,000; Full time

Job summary

Kaynes Semicon in India is seeking a Senior Process Engineer – OSAT (Assembly & Advanced Packaging) to develop and optimize semiconductor assembly and inspection processes. You will work on wafer bumping, laser grooving, die attach, wire bond, flip chip, molding, tin plating, and optical inspections within a robust OSAT environment.

The role collaborates with Quality, Equipment Engineering, and NPI teams to ensure process readiness for new products.

Qualifications

• Bachelor’s degree in engineering or related field with 8+ years OSAT assembly process engineering experience.
• Hands-on experience in OSAT assembly and inspection processes.
• Experience supporting NPI and volume manufacturing.

Responsibilities

• Develop, qualify, and release assembly and inspection processes to meet customer specs and internal standards.
• Define process windows, critical parameters, and control limits; drive yield, quality, and robustness.
• Lead NPI readiness, package transfer, qualification, and validation with customers and stakeholders.
• Provide day-to-day engineering support to assembly and inspection operations; analyze excursions and defects; drive root cause and corrective actions.

Skills

OSAT assembly process

Process documentation

Data analysis

Statistical methods

Education

Bachelor’s degree in engineering

Tools

SPC

DOE

PFMEA

Control Plan

Cp/Cpk

Job description

Designation: Senior Process Engineer – OSAT (Assembly & Advanced Packaging)

Department: Process Engineering / Assembly Manufacturing

Reporting To: Process Engineering Manager

Role Summary

• The Process Engineer – OSAT is responsible for the development, optimization, sustainment, and transfer of semiconductor assembly and inspection processes in an OSAT manufacturing environment.
• The role supports new product introduction (NPI), volume manufacturing, yield improvement, and advanced package deployment, ensuring robust, stable, and scalable assembly processes that meet customer, quality, and reliability requirements.
• The scope includes conventional and advanced semiconductor packages, working closely with Manufacturing, Quality, Equipment Engineering, and NPI/NPD teams.

Process Scope (OSAT – Assembly Only)

• Wafer bumping
• Laser grooving
• Die Prep
• Die Attach
• Wire Bond
• Flip Chip
• Mold / Compression Mold
• Tin Plating
• Singulation
• 2nd Optical Inspection
• 3rd Optical Inspection
• Final Visual Inspection (FVI)

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and release assembly and inspection processes in accordance with customer specifications and internal standards.
• Define process windows, critical parameters, and control limits.
• Drive continuous improvement in yield, quality, and process robustness.
• Establish and maintain process documentation including SOPs, WIs, control plans, and PFMEA.

NPI / NPD Support

• Lead process readiness for new product introduction and package transfer.
• Support process definition, risk assessment, and manufacturing ramp-up.
• Collaborate with customers and internal stakeholders during qualification and validation phases.
• Ensure smooth transition from development to volume manufacturing.

Manufacturing Support & Sustenance

• Provide day-to-day engineering support to assembly and inspection operations.
• Analyze process excursions, defect trends, and yield losses.
• Drive root cause identification and corrective actions using structured methodologies.
• Support audit readiness and customer technical reviews.

Quality & Reliability Interface

• Support defect reduction, escape prevention, and reliability improvement initiatives.
• Lead process change management, including validation and documentation updates.
• Ensure compliance with internal quality systems and customer requirements.
• Support failure analysis activities related to assembly and packaging processes.

Cross-Functional Collaboration & Training

• Work closely with Manufacturing, Quality, Equipment Engineering, and Training teams.
• Provide technical inputs for operator training and certification programs.
• Mentor junior engineers and technicians.
• Function as a technical interface for customers and internal stakeholders.

Methodologies & Engineering Tools

• Statistical Process Control (SPC)
• Design of Experiments (DOE)
• Process Failure Mode and Effects Analysis (PFMEA)
• Root Cause Analysis (5-Why, Fishbone, Pareto)
• Control Plan development
• Process capability analysis (Cp, Cpk)
• Phenomena Analysis
• APQP/PPAP
• Change management and risk assessment

Advanced Package Experience

• Power Module
• COB
• SoC
• QFN / DFN
• BGA / LGA
• FC-BGA / FC-CSP
• SiP (System-in-Package)
• Advanced wirebond (Cu wire, fine-pitch, multi-row)
• Flip Chip and hybrid assembly
• Thin packages and warpage-sensitive designs

Key Performance Indicators (KPIs)

• First Pass Yield (FPY)
• Assembly defect rate / DPPM
• Process capability performance (Cp/Cpk)
• NPI milestone adherence
• Scrap and rework reduction.
• Audit and customer findings closure effectiveness.

Qualifications

• Bachelor’s degree in engineering (Electronics, Electrical, Mechanical, Materials, Mechatronics, or related field)OR
• Equivalent experience (8+ years) in OSAT assembly process engineering with demonstrated technical competency.
• Strong hands‑on experience in OSAT assembly and inspection processes
• Experience supporting NPI and volume manufacturing.
• Knowledge of advanced semiconductor packaging technologies
• Strong analytical, problem‑solving, and technical communication skills
• Proficiency in process documentation and data analysis tools

This role may be designated as Process Engineer or Senior Process Engineer depending on experience, technical depth, and level of ownership in NPI and advanced packaging.