Principal Semiconductor Packaging Engineer

JR United Kingdom; Wolverhampton; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading edge client in Oxford is looking for a Principal Packaging Engineer to lead the packaging roadmap and collaborate with providers. Ideal candidates will have extensive experience in semiconductor and photonic packaging methods along with strong communication skills. This role offers the opportunity to innovate and develop effective packaging solutions for quantum processor devices.

Qualifications

• Experience in semiconductor/photonic packaging methods required.
• Knowledge of package substrate technologies is necessary.
• Familiarity with die bonding methods for thermal and mechanical performance preferred.

Responsibilities

• Steering the packaging roadmap for quantum processor devices.
• Developing wirebond and bumping methods, and photonics packaging methods.
• Designing and supervising failure analysis experiments.

Skills

Semiconductor packaging methods

Photonic packaging methods

Communication skills

Experience with 3rd party suppliers

Job description

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Other

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.