Principal Semiconductor Packaging Engineer

JR United Kingdom; Derby; On-site; GBP 50,000 - 80,000; Full time

Job summary

A leading Oxford-based client is seeking a Principal Packaging Engineer to develop advanced packaging methods for quantum processor devices. The role involves collaboration with providers, development of wirebond techniques, and overseeing experimentation for product reliability.

Qualifications

• Experienced in semiconductor and photonic packaging methods.
• Knowledge of die bonding methods for thermal performance.
• Strong communication skills essential.

Responsibilities

• Steering the packaging roadmap with internal and external providers.
• Developing and producing thermal performance packaging methods.
• Designing and supervising failure analysis experiments.

Skills

semiconductor/photonic packaging methods

package substrate technologies

die bonding methods

3rd party supplier collaboration

communication skills

Job description

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Client:

IC Resources

Location:

derby, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.