Lead Semiconductor Packaging Engineer

Nexperia; Manchester; Hybrid; GBP 90,000 - 130,000; Full time

Benefits offered by this job

Visa sponsorship

Relocation assistance

Hybrid working policy

Job summary

Nexperia in the United Kingdom is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead design studies and serve as a recognised expert, shaping technology roadmaps and collaborating with product lines, assembly sites and R&D teams.

The role demands a PhD with 5+ years in packaging, plus experience in DOE, simulation, and failure analysis, with a proven record of innovation. Hybrid work, competitive pay, and global impact await.

Qualifications

• PhD with 5+ years in semiconductor packaging.
• Expert in packaging and assembly technologies.
• Experience with DOE, data analysis and root-cause investigations.

Responsibilities

• Lead package design studies for new and existing products.
• Serve as SME in semiconductor packaging and assembly technologies.
• Evaluate emerging package technologies to maintain leadership.
• Support validation of new concepts through simulations and studies.
• Mentor junior engineers and lead technical projects.

Skills

Semiconductor packaging

DOE

Data analysis

Technical leadership

Stakeholder management

Education

PhD in Electrical/Materials Science or related

Tools

Package design software

Simulation tools

Job description

Nexperia in the United Kingdom is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead design studies and serve as a recognised expert, shaping technology roadmaps and collaborating with product lines, assembly sites and R&D teams.

The role demands a PhD with 5+ years in packaging, plus experience in DOE, simulation, and failure analysis, with a proven record of innovation. Hybrid work, competitive pay, and global impact await.