Packaging Engineer

microTECH Global LTD; Manchester; Vor Ort; GBP 60.000 - 80.000; Vollzeit

Zusammenfassung

microTECH Global LTD is seeking a hands-on MEMS Manufacturing Engineer to drive assembly processes from prototype to pilot-scale. You will work with multidisciplinary teams to optimize workflows, improve yields and transition R&D into scalable production.

The role focuses on die attach, wire bonding, packaging, tooling, and documentation, with emphasis on DfM/DfA and NPI. Cleanroom environment and collaboration with external partners are expected.

Qualifikationen

• Degree in Engineering, Physics or a related discipline is required.
• 3+ years in semiconductor, MEMS, photonics or related manufacturing.
• Experience with packaging, die attach, wire bonding or precision assembly.
• Strong process development and problem-solving skills.
• Experience creating manufacturing procedures and documentation.
• Comfortable in a fast-paced hands-on environment.
• Cleanroom manufacturing experience and CAD for fixtures/tooling.
• Reliability testing, failure analysis and SPC experience.
• Experience with wafer-level or advanced semiconductor packaging.

Aufgaben

• Build and assemble MEMS-based prototype devices and subsystems.
• Develop and optimise manufacturing and assembly processes.
• Perform and improve die attach, wire bonding, packaging and precision assembly activities.
• Design and implement tooling, fixtures, jigs and assembly aids.
• Troubleshoot manufacturing, reliability and yield issues.
• Drive Design for Manufacture and Design for Assembly improvements.
• Create manufacturing documentation, SOPs and work instructions.
• Support New Product Introduction and manufacturing scale-up activities.
• Work with external partners as production grows.

Kenntnisse

MEMS manufacturing

Process development

Die attach

Wire bonding

Packaging

DFM/DFA

SPC

Documentation

Cleanroom

Ausbildung

Engineering/Physics degree

Related discipline

Tools

CAD for fixtures

OSAT coordination

Jobbeschreibung

An exciting opportunity has arisen for a hands-on MEMS Manufacturing Engineer to join an innovative deep-tech company developing next-generation MEMS sensing technology.

This role will be instrumental in taking advanced MEMS devices from prototype development through to pilot-scale manufacturing. Working closely with multidisciplinary engineering teams, you will develop assembly processes, optimise manufacturing workflows, improve yields, and support the transition from R&D into scalable production.

Key Responsibilities:

• Build and assemble MEMS-based prototype devices and subsystems.
• Develop and optimise manufacturing and assembly processes.
• Perform and improve die attach, wire bonding, packaging and precision assembly activities.
• Design and implement tooling, fixtures, jigs and assembly aids.
• Troubleshoot manufacturing, reliability and yield issues.
• Drive Design for Manufacture (DfM) and Design for Assembly (DfA) improvements.
• Create manufacturing documentation, SOPs and work instructions.
• Support New Product Introduction (NPI) and manufacturing scale-up activities.
• Work with external manufacturing, foundry and packaging partners as production grows.

Requirements:

• Degree in Engineering, Physics, Materials Science or a related discipline.
• 3+ years' experience within semiconductor, MEMS, photonics or advanced technology manufacturing.
• Experience with semiconductor packaging, die attach, wire bonding or precision assembly processes.
• Strong process development and problem-solving skills.
• Experience developing manufacturing procedures and documentation.
• Comfortable working in a fast-paced, hands-on engineering environment.
• Cleanroom manufacturing environments.
• CAD design for fixtures and tooling.
• Reliability testing and failure analysis.
• Statistical Process Control (SPC).
• Wafer-level or advanced semiconductor packaging.
• Working with foundries, OSATs or contract manufacturers.