Principal Advanced Packaging Engineer (R&D)

PragmatIC Semiconductor; Tees Valley; On-site; GBP 90,000 - 120,000; Full time

Job summary

Pragmatic Semiconductor is seeking a Principal Advanced Packaging Engineer to lead the technical development of FlexIC wafer-level and chip-scale packaging, die attachment, and system integration across Sedgefield and Durham sites. The role requires deep experience in semiconductor packaging, MEMS/flexible electronics, and cross-functional collaboration.

Visa sponsorship and relocation assistance are available.

Qualifications

• Degree or postgraduate qualification in a relevant discipline such as Electronic Engineering, Mechanical Engineering, Materials Science, Physics or MEMS.
• Project Management qualifications would be beneficial but not essential.

Responsibilities

• Lead the technical development of FlexIC wafer-level packaging (WLP), wafer-level chip-scale packaging (WLCSP), die attachment and System in Package integration processes.
• Deliver robust FlexIC packaging solutions meeting technical, reliability, manufacturability and programme requirements.
• Set technical direction, priorities and development plans including materials, processes, suppliers and external partners.
• Provide specialist packaging and assembly expertise across FlexIC interconnects development streams, including wafer debonding process development.
• Establish and validate scalable approaches with clear process windows and documented results.
• Make day-to-day technical decisions and coordinate priorities across R&D, Engineering, Operations and external partners.

Skills

Advanced packaging

RDL & wafer bumping

Die attach & bonding

MEMS & flexible electronics

Reliability qualification

DfM & process transfer

Cross-functional collaboration

Education

Bachelors or higher in Electronic/Mechanical Engineering, Materials Science, Physics or MEMS

Job description

Overview

We have an excellent opportunity in our Technology group for a Principal Advanced Packaging Engineer to join our growing team!

Based in the North East across our Sedgefield and Durham sites, this is a newly-created role with responsibility for leading the technical development of FlexIC Wafer Level Packaging (WLP), Wafer Level Chip Scale Packaging (WLCSP), die attachment and system level integration.

You will drive the internal roadmap, working with teams such as Product Management, Engineering and Operations, and will apply specialist knowledge to help us achieve our objectives.

This is therefore a key position at Pragmatic, with the opportunity to play a genuinely leading role in our Advanced Packaging development.

We are looking for candidates with deep technical expertise in these areas, as well as the ability to drive cross-functional projects and communicate effectively with internal and external stakeholders.

Visa sponsorship and relocation assistance will be offered to the successful candidate, if required.

Key tasks

• Lead the technical development of FlexIC wafer-level packaging (WLP), wafer-level chip-scale packaging (WLCSP), die attachment and System in Package integration processes for FlexIC interconnects

• Deliver and demonstrate robust FlexIC packaging solutions that meet agreed technical, reliability, manufacturability and programme requirements

• Set technical direction, priorities and development plans, including selection of materials, processes, suppliers and external development partners

• Provide specialist packaging and assembly expertise across the FlexIC interconnects development streams, including wafer debonding process development

• Establish and validate scalable approaches, with clear process windows, documented results and effective transfer to relevant teams

• Make day-to-day technical decisions, resolve development risks and coordinate priorities across R&D, Engineering, Operations and external partners

Qualifications and training

You will ideally be educated to degree or postgraduate qualification in a relevant discipline such as Electronic Engineering, Mechanical Engineering, Materials Science, Physics or MEMS (or you will possess equivalent experience).

Project Management qualifications would be beneficial but not essential.

Skills and experience

• Strong experience in advanced semiconductor packaging techniques including plating, redistribution layers (RDL), wafer bumping, bonding and debonding, encapsulation and dicing

• Strong experience in semiconductor, MEMS and/or flexible electronics assembly techniques: including direct die attach, flip chip, thermocompression bonding, solder reflow and wire bonding

• Experience of reliability qualification (JEDEC, IPC), failure analysis and process characterisation (DOE, SPC)

• Experience in transferring process feasibility and development activities to process engineering, with a strong focus on Design for Manufacturability (DfM)

• Experience in leading development projects involving internal teams and external partners

• Strong knowledge and understanding of semiconductor fabrication techniques

• Ability to manage multiple projects in parallel and deliver to tight deadlines

• Strong communication and interpersonal skills, both within the team and with external stakeholders

• Ability to work independently and as part of a team

Candidates who do not meet every requirement but feel their skills are a good fit for the role the role are encouraged to apply.

Pragmatic Semiconductor is committed to equity, equality, diversity, and inclusion; we strive to welcome everyone and create inclusive teams. We celebrate difference and encourage everyone to be themselves at work. Please let us know if you would like any adjustments to our application and interview process.