Package Design Engineer – Imaging & Microelectronics

FLIR Systems, Inc.; Grenoble; Sur place; EUR 50 000 - 70 000; Plein temps

Avantages offerts par ce poste

Teleworking agreement

Structured onboarding program

Flexible work environment

Résumé du poste

A leading technology company is seeking a Package Design Engineer for their site near Grenoble, France. The successful candidate will manage the design flow of advanced microelectronic packages, interacting closely with vendors and project teams. Candidates should have a background in microelectronics or a related field, along with experience in packaging design. Strong communication skills in English and French are required. This role offers a collaborative environment focused on innovation and continuous improvement.

Qualifications

• First confirmed experience in packaging design.
• Specific experience in imaging or assembly is a plus.
• Experience in managing package vendors and assembly houses.

Responsabilités

• Manage the full design flow of microelectronics packaging.
• Interact with project teams for implementation.
• Conduct design reviews and technical evaluations.

Connaissances

Background in microelectronics

Experience in packaging design

Mastering packaging layout

Knowledge of mechanical design

Good level of English

Formation

Degree in Electronics or Material Science

Outils

Cadence APD

SolidWorks

Ansys

Description du poste

A leading technology company is seeking a Package Design Engineer for their site near Grenoble, France. The successful candidate will manage the design flow of advanced microelectronic packages, interacting closely with vendors and project teams. Candidates should have a background in microelectronics or a related field, along with experience in packaging design. Strong communication skills in English and French are required. This role offers a collaborative environment focused on innovation and continuous improvement.