Quantum Packaging Engineer (3D/2.5D)

Quantum Software; Paris; Hybride; EUR 60 000 - 78 000; Plein temps

Avantages offerts par ce poste

Stock options

Conference travel

Meal vouchers

Dynamic international team

Learning & development

Sabbatical after 2 years

Office in Paris

Résumé du poste

C12 Quantum Electronics in Paris seeks a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum computing hardware. You will design interconnects between quantum devices, control electronics, photonic components, and cryogenic systems while maintaining signal integrity, thermal performance and reliability.

The role requires a degree in engineering and hands-on experience in semiconductor packaging and 3D integration, with strong CAD

Qualifications

• Bachelor's or Master’s degree in electrical engineering, materials science, mechanical engineering, applied physics, or related discipline.
• Experience in semiconductor packaging, wafer-level integration, MEMS, microfabrication, or heterogeneous integration.
• Familiar with processes: wafer bonding, hybrid bonding, TSVs, flip-chip assembly, thin-film deposition, lithography, etching, electroplating, or CMP.
• Familiar with package-level electrical, thermal, and mechanical design.
• Experience with CAD, electromagnetic simulation tools, multiphysics simulation, statistical analysis, or semiconductor process-development tools.
• Strong experimental, troubleshooting, documentation, and cross-functional communication skills.

Responsabilités

• Develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
• Design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
• Integrate QPU with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
• Perform electrical, electromagnetic, mechanical, and thermal simulations.
• Define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
• Develop test vehicles and perform experimental measurements on fabricated devices; analyze data to improve yield and performance.
• Document designs, process specifications, qualification results, and technology roadmaps.
• Collaborate with quantum-device, circuit-design, cryogenic, materials, manufacturing, and systems teams.

Connaissances

3D integration

Electrical engineering

Semiconductor packaging

CAD

Thermal analysis

Formation

Bachelor's or Master's in EE

Outils

CAD tools

EM simulation tools

Multiphysics simulation

Description du poste

C12 Quantum Electronics in Paris seeks a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum computing hardware. You will design interconnects between quantum devices, control electronics, photonic components, and cryogenic systems while maintaining signal integrity, thermal performance and reliability.

The role requires a degree in engineering and hands-on experience in semiconductor packaging and 3D integration, with strong CAD