Semiconductor Process Development Engineer

Li Auto Inc.; München; Hybrid; EUR 70,000 - 110,000; Full time

Job summary

Li Auto Inc. in Munich seeks a Semiconductor Process Development Engineer to drive DoE-driven development of SiC die attach processes and interconnections for power modules.

You will collaborate with suppliers, operate sintering and precision tools, perform failure analysis with CSAM and optical microscopy, and generate reports while supporting cleanroom setup. Candidates should hold a Master’s or higher in a related field, with 3–5 years of semiconductor processing or packaging experience and

Qualifications

• Master’s degree or higher in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or related fields.
• 3–5 years of relevant industry or research experience in semiconductor processing or advanced packaging.
• Strong self-motivation and a results-driven mindset with curiosity and learning drive.
• Hands-on experience with manufacturing/prototyping equipment in semiconductor industry; cleanroom experience is a plus.
• Fluent English is required as the working language.
• Experience with mechanical design including drawings, tolerance analysis, fixture/jig design is a plus.

Responsibilities

• Conduct literature research and Design of Experiments (DoE) to support development of SiC die attach processes.
• Perform process development for power module-to-heatsink interconnection and evaluate new materials and processes.
• Operate advanced packaging manufacturing equipment such as sintering equipment and CNC/laser tools.
• Perform failure analysis and quality inspection using CSAM and optical microscopy.
• Generate structured technical reports and documentation.
• Support cleanroom setup, including equipment installation, qualification, and commissioning.
• Investigate and develop new materials, processes, and technologies and contribute to process roadmaps.
• Coordinate with external partners and suppliers, organize meetings, and prepare minutes.

Education

Master’s degree or higher in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or related fields

3–5 years of semiconductor processing/advanced packaging experience

Fluent English

Tools

CSAM

Optical Microscopy

Job description

Semiconductor Process Development Engineer

1. Conduct literature research and Design of Experiments (DoE) to support the development of SiC semiconductor die attach processes (e.g., sintering, soldering, embedding)；
2. Perform process development for power module-to-heatsink interconnection and evaluate new material& processes, including literature review, DoE design, and technical discussions with suppliers and partners.

Operate advanced packaging manufacturing equipment, including:

• Sintering equipment
• CNC machining and laser processing tools

1. Perform failure analysis and quality inspection using tools such as:

• CSAM (C-Scan Acoustic Microscopy)
• Optical microscopy and other characterization tools

Generate structured technical reports and documentation

Support cleanroom setup, including equipment installation, qualification, and commissioning；

Investigate and develop new materials, processes, and technologies, and contribute to process roadmaps for next-generation power modules and other semiconductor application fileds；

Coordinate with external partners and suppliers, organize technical meetings, and prepare meeting minutes and progress reports.

1. Master’s degree or higher in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or related fields;
2. 3–5 years of relevant industry or research experience in semiconductor processing or advanced packaging, strong semiconductor knowledge and background;
3. Strong self-motivation and a results-driven mindset; with strong curiosity and a passion for learning; demonstrates a proactive, ownership mindset with disciplined use of R&D resources and a strong ambition to deliver high-impact results and contribute to shaping the future of the industry;
4. Hands-on experience with manufacturing/prototyping equipment in semiconductor industry or semiconductor packaging is highly preferred, cleanroom working experience is a plus;
5. Experience in mechanical design, including: Engineering drawings Tolerance analysis Fixture/jig design Module/package design is a plus;
6. Fluent English is required as the working language;
7. Experience using AI agents/tools to increase working efficiency is a plus.

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