Senior Power Module Development & Test Engineer

Li Auto Inc.; München; On-site; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Modern working environment in Munich

International collaboration

Professional growth

Job summary

Li Auto Inc. is seeking a hands-on engineer for its Semiconductor Advanced Research team in Munich to advance power semiconductors, packaging, and cooling solutions.

You will lead cross-functional efforts across design, simulation, testing, and validation to deliver robust power-module designs that meet stringent specifications. The role emphasizes collaboration with international teams, mentoring engineers, and driving testing activities from concept to manufacturability, with strong emphasis

Qualifications

• Master’s degree or PhD in microelectronics, power electronics, electrical engineering, semiconductor physics, thermal engineering, or related discipline.
• 5+ years hands-on experience in power-semiconductor or power-module design or testing.
• Fluent in written and spoken English.

Responsibilities

• Support design and development of power modules based on specifications, including PCB layout and 3D mechanical design using EDA/CAD tools.
• Collaborate with electrical/thermal simulation and process development teams to translate concepts into manufacturable designs.
• Develop test plans and supervise testing of power-module performance (I-V, DPT, SC).
• Oversee characterization for discrete devices and packages (TO-247) and analyze results.
• Develop and maintain SiC/GaN test benches and thermal-measurement platforms.
• Manage electrical engineers and interns in the power-electronics lab and coordinate testing activities.
• Design/testing hardware (gate-driver boards, adapters) and review schematics/PCB layouts with Altium/CAD tools.

Skills

Power electronics

Semiconductor modules

Thermal-electrical co-design

Leadership

Education

Master’s or PhD in microelectronics / power electronics / EE

Tools

Altium Designer

CATIA

Cadence

SolidWorks

Job description

Our Semiconductor Advanced Research team develops next-generation semiconductor, packaging, and application technologies for electric vehicle and embodied AI products. We combine system-level design, advanced packaging, simulation, testing, and failure analysis to transform early-stage concepts into validated demonstrators.

We are looking for a hands‑on, self‑driven engineer with strong expertise in power or MEMS semiconductor modules, packaging technologies, and electro‑thermal‑mechanical co‑design. You will work in a cross‑functional and international team to develop, validate, and continuously improve advanced power semiconductors, packaging technologies and advanced cooling solutions.

• Support the design and develop power modules based on defined technical requirements and specifications, including PCB layout and 3D mechanical design, using EDA and CAD tools such as Altium Designer, CATIA.
• Work closely with electrical‑simulation, thermal‑simulation, and process‑development experts to translate concepts into robust, manufacturable power‑module designs.
• Develop test plans and procedures for evaluating power‑module performance, including static I–V characterization, double‑pulse testing (DPT), and short‑circuit (SC) testing. Supervise test execution by engineers and interns and review the results.
• Define and oversee characterization activities for discrete power‑semiconductor devices and packages (e.g., TO-247) from semiconductor vendors, including test planning, validation against datasheet specifications, and analysis of results.
• Develop, commission, maintain, and enhance SiC/GaN power‑semiconductor and power‑module test benches, including double‑pulse, short‑circuit, and insulation tests.
• Establish and operate a thermal‑resistance (Rth) measurement and evaluation platform to assess interconnect/bonding and cooling technologies.
• Manage and supervise electrical engineers and interns in the power‑electronics lab, overseeing daily laboratory operations, coordinating testing activities, and collaborating with power‑electronics teams to support the testing and validation of magnetics, OBCs, DC/DC converters, and inverter–motor assemblies.
• Take responsibility for the design and development of test adapters, gate‑driver boards, and other testing hardware for power‑electronics testing and characterization, including supervising design activities, reviewing schematics and PCB layouts, and ensuring design quality using EDA tools such as Altium Designer and CAD software.

Education/Experience

• Master’s degree or PhD in microelectronics, power electronics, electrical engineering, semiconductor physics, thermal engineering, or a related discipline.
• Over five years of hands‑on experience in power‑semiconductor or power‑module design or testing. Experience testing power‑electronics systems, including OBCs, DC/DC converters, and magnetics, is advantageous.
• Working knowledge of key power‑module design considerations, including the layout and current sharing of paralleled semiconductor devices.
• Practical experience with power‑semiconductor or power‑module testing and characterization, including double‑pulse testing, short‑circuit testing, static characterization, thermal testing, insulation testing, or reliability testing.
• Foundational understanding of power semiconductors and power modules, including switching behavior, paralleling techniques, and reliability mechanisms.
• Experience with PCB design tools such as Altium Designer or Cadence. Familiarity with 3D mechanical CAD tools such as CATIA or SolidWorks is a plus.
• A strong sense of ownership: addresses issues transparently and constructively through root‑cause analysis.
• Highly self‑motivated and proactive, with the ability to identify opportunities, risks, and gaps independently and move work forward without close supervision.
• Professional fluency in written and spoken English.

About Li Auto:

We’re a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services.

What we offer:

• A modern working environment in Munich.
• The opportunity to collaborate with industry‑leading experts in semiconductors, power electronics, packaging, and vehicle technology.
• Exposure to cutting‑edge semiconductor and packaging technologies with direct relevance to next‑generation EV products / power conversion / embodied AI products.
• A multicultural, entrepreneurial environment with opportunities for professional growth and international collaboration.
• Opportunities to build a professional network across Europe and China.