Strategic AI Interconnect Architect

Kandou AI; Saint-Sulpice; Vor Ort; CHF 180.000 - 260.000; Vollzeit

Zusammenfassung

Kandou AI is seeking a Technical Advisor / Principal Architect to work with the CTO on the conception, modeling, and development of breakthrough communication and interconnect technologies. This role combines research, modeling, algorithm development, system architecture, and early silicon feasibility, translating theory into manufacturable, silicon‑driven solutions.

You will influence chip‑to‑chip, die‑to‑die, memory and networking interconnects across the product lifecycle in a fast‑moving

Qualifikationen

• Advanced degree required in a technical field.
• Strong foundation in digital communications and information theory.
• Experience with mathematical modeling, simulations, or prototypes.

Aufgaben

• Partner with CTO to develop next-gen comm and interconnect architectures.
• Build models, simulations, and prototypes to validate concepts.
• Evaluate tradeoffs in performance, power, latency, area, manufacturability.
• Translate research into silicon-ready architectures and IP.
• Provide technical leadership across research, architecture, and product teams.

Kenntnisse

Digital communications

Information theory

Coding theory

Mathematical modeling

Python

C++

System architecture thinking

Ausbildung

Advanced degree in EE/CE/Applied Math/Physics

Tools

SystemC

MATLAB

Simulations

Silicon debugging

Jobbeschreibung

Kandou AI is seeking a Technical Advisor / Principal Architect to work with the CTO on the conception, modeling, and development of breakthrough communication and interconnect technologies. This role combines research, modeling, algorithm development, system architecture, and early silicon feasibility, translating theory into manufacturable, silicon‑driven solutions.

You will influence chip‑to‑chip, die‑to‑die, memory and networking interconnects across the product lifecycle in a fast‑moving