Principal Architect for AI Interconnects & Silicon

Kandou Bus SA; Saint-Sulpice; Hybrid; CHF 180.000 - 240.000; Vollzeit

Zusammenfassung

Kandou AI is seeking a Technical Advisor / Principal Architect to work with the CTO on conceiving and prototyping breakthrough interconnect technologies. This role spans research, modeling, and early silicon feasibility, translating theory into scalable products.

You will lead architectural exploration, evaluate tradeoffs, and help shape memory‑fabric and chip‑to‑chip interconnect innovations for high bandwidth, low latency AI hardware.

Qualifikationen

• Advanced degree in Electrical/Computer Engineering, Applied Mathematics, Physics, or related field.

Aufgaben

• Partner with the CTO to develop next-generation communication and interconnect architectures.
• Explore signaling, coding, equalization, and system-level techniques.
• Build models, simulations, and prototypes to validate architectural concepts.
• Evaluate performance, power, latency, area, and manufacturability tradeoffs.
• Translate research into silicon-ready architectures and IP.
• Identify emerging technologies and opportunities for differentiation.
• Provide technical leadership across research, architecture, and product teams.

Kenntnisse

Digital communications

Information theory

Coding & modulation

Signal processing

Prototyping & modeling

Python / MATLAB / C++

Ausbildung

Advanced degree in EE / CE / Applied Math / Physics

Tools

Python

MATLAB

C++

SystemC

Jobbeschreibung

Kandou AI is seeking a Technical Advisor / Principal Architect to work with the CTO on conceiving and prototyping breakthrough interconnect technologies. This role spans research, modeling, and early silicon feasibility, translating theory into scalable products.

You will lead architectural exploration, evaluate tradeoffs, and help shape memory‑fabric and chip‑to‑chip interconnect innovations for high bandwidth, low latency AI hardware.