Mach aus dieser Rolle ein Vorstellungsgespräch — ein Lebenslauf und ein Anschreiben, die darauf ausgerichtet sind, was dieser Arbeitgeber sucht.
Kandou AI is seeking a Technical Advisor / Principal Architect to work with the CTO on conceiving and prototyping breakthrough interconnect technologies. This role spans research, modeling, and early silicon feasibility, translating theory into scalable products.
You will lead architectural exploration, evaluate tradeoffs, and help shape memory‑fabric and chip‑to‑chip interconnect innovations for high bandwidth, low latency AI hardware.
Kandou AI is redefining the economics of AI infrastructure. Our proprietary MIMO‑over‑copper technology powers a high‑performance, chiplet‑based AI memory fabric that delivers high bandwidth and ultra‑low latency at dramatically lower power. Our architecture represents a foundational shift in how next‑generation AI hardware is built.
We are seeking a Technical Advisor / Principal Architect to work directly with the CTO on the conception, modeling, and development of breakthrough communication and interconnect technologies.
This is a rare opportunity for an engineer who thrives at the intersection of theory, architecture, and silicon implementation — someone who wants to help shape the future of chip‑to‑chip, die‑to‑die, memory, and networking interconnects.
You will partner closely with the CTO to explore, evaluate, and prototype next‑generation communication system architectures. This role spans research, modeling, algorithm development, system architecture, and early‑stage silicon feasibility. You will help translate theoretical concepts into implementable designs that can scale into real products.
The ideal candidate: