Associate Process Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.; Região Norte; Presencial; BRL 67 000 - 100 000; Tempo integral

Resumo da oferta

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking aTechnical support professional to assist Process Engineers in Wafer Level Die Dept.

The role focuses on troubleshooting, root cause analysis, and continuous improvement to ensure product quality and cost effectiveness. Candidates should have a Diploma and at least 2 years in wafer fabrication and be able to work 12-hour rotating shifts. The successful applicant will participate in process baseline validation, disposition of non-conforming material,

Qualificações

• Diploma in Mechanical Engineering, Physics, Chemical, Material Sciences or equivalent.
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication.
• Ability to work on 12 hours rotating shift.

Responsabilidades

• First level troubleshooting and root cause analysis pertaining to line issues.
• Provide daily lot disposition for non-conformance material with interim or/and long-term corrective actions.
• Execute lot disposition.
• Perform periodic process baseline validation.
• Co-work with Process Engineers and Equipment Engineers to verify root cause, to establish corrective actions and systematic preventive action for process and product related issues.
• Assist and sustain continuous process improvement through data analysis, evaluations and verifying & executing procedures.
• Ensure that products meet all customers' requirements in terms of quantity, yield and cycle time by eliminating repeated non-conformance incidences and sustaining process improvement.
• Support new product/process qualification build.
• Track product quality performance.
• New product recipe setup per Process Engineer Requirement

Conhecimentos

Root cause analysis

Troubleshooting

Data analysis

Formação académica

Diploma in Mechanical Engineering or related field

Descrição da oferta de emprego

About the role

To provide technical and administrative support to Process Engineers in Wafer Level Die Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.

Key responsibilities

• First level troubleshooting and root cause analysis pertaining to line issues

• Provide daily lot disposition for non-conformance material with interim or/and long-term corrective actions

• Execute lot disposition

• Perform periodic process baseline validation

• Co-work with Process Engineers and Equipment Engineers to verify root cause, to establish corrective actions and systematic preventive action for process and product related issues

• Assist and sustain continuous process improvement through data analysis, evaluations and verifying & executing procedures

• Ensure that products meet all customers' requirements in terms of quantity, yield and cycle time by eliminating repeated non-conformance incidences and sustaining process improvement

• Support new product/process qualification build

• Track product quality performance

• New product recipe setup per Process Engineer Requirement

About you

• Diploma in Mechanical Engineering, Physics, Chemical, Material Sciences or equivalent

• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication

• Ability to work on 12 hours rotating shift