Process Engineer - Edge Trim & Dicing for 3D IC Packaging

imec; Vlaams-Brabant; Sur place; EUR 65 000 - 90 000; Plein temps

Résumé du poste

We are seeking a Process Engineer Dicing to join imec’s Bonding, Assembly and Wafer level packaging team (BAW) within the Materials, Transfer and Assembly group (MATA) in Leuven, Belgium. You will develop edge trim and dicing processes for 3D-heterogeneous/packaging applications, working mainly in the cleanroom, with experienced staff support.

You will collaborate closely with researchers, hardware engineers and industrial partners, report findings, and contribute to joint development programs.

Qualifications

• Master’s degree in chemistry, physics, materials science or engineering; PhD or relevant research/industrial experience is an advantage.
• Foundry or OSAT experience in wafer-to-wafer bonding and semiconductor materials with characterization/FA.
• Know-how in data analysis and scripting (Matlab, Python) and JMP is an asset.
• Strong project management skills and ability to work independently with a focus on quality.
• Experience participating in cross-functional teams and projects using scientific and engineering skills.
• Enthusiastic, creative team player with networking, communication and reporting skills in a multicultural team and client interactions.
• Autonomous, well-organized, careful with high standards.
• Hands-on in a clean room environment; flexible attitude in international setting.
• Good English knowledge (spoken/written).

Responsabilités

• Define, organize, set up and validate new edge trim and dicing processes.
• Identify metrology solutions to characterize these processes.
• Contribute to research programs and joint development projects with external partners.
• Collaborate cross-functionally with integration, process support, and hardware teams and industrial partners.
• Report progress to internal and external partners and publish findings.
• Initiate fundamental research on new materials and perform characterization and failure analysis.
• Monitor industry trends and apply knowledge to imec programs and activities.
• Interface with device engineers to identify future needs and trends.
• Coordinate non-standard work in imec’s fab together with fab process engineers and pilot line.
• Start-up of new equipment.

Connaissances

Data analysis

Project management

Independent work

Cross-functional teamwork

Communication and reporting

Multicultural teamwork

English proficiency

Attention to detail

Hands-on in clean room

Formation

Master’s degree in chemistry, physics, materials science or engineering

PhD or relevant experience advantage

Outils

MATLAB

Python

JMP

Description du poste

We are seeking a Process Engineer Dicing to join imec’s Bonding, Assembly and Wafer level packaging team (BAW) within the Materials, Transfer and Assembly group (MATA) in Leuven, Belgium. You will develop edge trim and dicing processes for 3D-heterogeneous/packaging applications, working mainly in the cleanroom, with experienced staff support.

You will collaborate closely with researchers, hardware engineers and industrial partners, report findings, and contribute to joint development programs.