R&D Release Technology Process Engineer

Imec India Private Limited; Heverlee; Sur place; EUR 70 000 - 100 000; Plein temps

Résumé du poste

IMEC in Leuven, Belgium, invites applications for an R&D Release Technology Process Engineer to develop and optimize laser release processes for advanced material transfer and 3D integration concepts. You will work with cross‑functional teams to mature new release technologies into pilot‑line processes.

The role requires Master’s or PhD in a relevant field, experience with wafer bonding and laser release, and strong analytical and communication skills.

Qualifications

• Master’s or PhD degree in Physics, Chemistry, Industrial or Materials Science.
• Experience with wafer bonding, laser release, bonding, layer transfer or related semiconductor processing is an advantage.
• Preferably a good understanding of semiconductor manufacturing processes such as lithography, etch, CMP or thin‑film deposition.
• A self‑driven and innovative mindset and you will take ownership of process improvement activities.
• A passion about application development, data interpretation and are focused on achieving high quality results. Knowledge of Matlab, Python, JMP… is a plus.
• The ability to work both independently and collaboratively in a multidisciplinary team environment.
• Excellent communication skills and the confidence to present technical results to diverse audiences.
• A strong spoken and written English communication skills.

Responsabilités

• Develop and optimize laser release processes for advanced material transfer.
• Design, execute and analyse experiments to improve process performance and robustness.
• Perform hands‑on process development in the cleanroom and contribute to daily operation of the release process.
• Drive process maturity from exploratory research towards pilot‑line implementation.
• Analyse process data, identify improvement opportunities, and solve complex technical challenges.
• Present results and recommendations to project teams, management, industrial partners and customers.
• Collaborate closely with integration engineers, operations, equipment vendors and material experts.
• Act as the interface between the Material Transfer research team and the engineering organization, ensuring successful technology transfer into the pilot line.

Connaissances

Wafer bonding

Laser release

Layer transfer

Data interpretation

English communication

Formation

Master’s or PhD in Physics, Chemistry, Industrial or Materials Science

Outils

Matlab

Python

JMP

Description du poste

R&D Release Technology Process Engineer

What you will do

You will develop and optimize wafer release technologies that make advanced heterogeneous integration possible. Heterogeneous integration combines different materials, devices, and technologies into a single system to achieve higher performance and functionality. Advanced bonding processes with extremely precise overlay accuracy and exceptional wafer distortion control are enabling entirely new integration schemes for future semiconductor devices. The transfer of thin functional layers, such as epitaxial ruthenium, III‑V semiconductors, diamond… from their original substrates to new target wafers further unlocks new integration and opportunities. These approaches require highly reliable release technologies that not only preserve the transferred material but also enable the reuse of often expensive donor wafers, reducing material consumption, lowering costs, and, as a result, improving the sustainability of the overall manufacturing process.

As a member of the Material Transfer (MAT) team, you will develop, execute, and optimize laser release processes for both wafer and die‑level applications. You will work closely with process integration engineers, researchers, equipment suppliers, and engineering teams to mature new release technologies and convert early research concepts into robust pilot‑line processes.

Your work will support a broad range of research programs and projects (e.g., 3D integration, optical I/O, advanced interconnect, RF…). You will operate in a multidisciplinary and international environment where material science, process engineering, and equipment development come together to create technologies that do not yet exist in manufacturing.

• Develop and optimize laser release processes for advanced material transfer.
• Design, execute and analyse experiments to improve process performance and robustness.
• Perform hands‑on process development in the cleanroom and contribute to daily operation of the release process.
• Drive process maturity from exploratory research towards pilot‑line implementation.
• Analyse process data, identify improvement opportunities, and solve complex technical challenges.
• Present results and recommendations to project teams, management, industrial partners and customers.
• Collaborate closely with integration engineers, operations, equipment vendors and material experts.
• Act as the interface between the Material Transfer research team and the engineering organization, ensuring successful technology transfer into the pilot line.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, our corporate university, we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

You are passionate about semiconductor process development and enjoy solving challenging technical problems. You also have:

• You have a Master’s or PhD degree in Physics, Chemistry, Industrial or Materials Science.
• Experience with wafer bonding, laser release, bonding, layer transfer or related semiconductor processing is a strong advantage.
• Preferably a good understanding of semiconductor manufacturing processes such as lithography, etch, CMP or thin‑film deposition.
• A self‑driven and innovative mindset and you will take ownership of process improvement activities.
• A passion about application development, data interpretation and are focused on achieving high quality results. Knowledge of Matlab, Python, JMP… is a plus.
• The ability to work both independently and collaboratively in a multidisciplinary team environment.
• Excellent communication skills and the confidence to present technical results to diverse audiences.
• A strong spoken and written English communication skills.

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee‑based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.