Innovative Wafer Release Process Engineer – R&D

Imec India Private Limited; Heverlee; Sur place; EUR 70 000 - 100 000; Plein temps

Résumé du poste

IMEC in Leuven, Belgium, invites applications for an R&D Release Technology Process Engineer to develop and optimize laser release processes for advanced material transfer and 3D integration concepts. You will work with cross‑functional teams to mature new release technologies into pilot‑line processes.

The role requires Master’s or PhD in a relevant field, experience with wafer bonding and laser release, and strong analytical and communication skills.

Qualifications

• Master’s or PhD degree in Physics, Chemistry, Industrial or Materials Science.
• Experience with wafer bonding, laser release, bonding, layer transfer or related semiconductor processing is an advantage.
• Preferably a good understanding of semiconductor manufacturing processes such as lithography, etch, CMP or thin‑film deposition.
• A self‑driven and innovative mindset and you will take ownership of process improvement activities.
• A passion about application development, data interpretation and are focused on achieving high quality results. Knowledge of Matlab, Python, JMP… is a plus.
• The ability to work both independently and collaboratively in a multidisciplinary team environment.
• Excellent communication skills and the confidence to present technical results to diverse audiences.
• A strong spoken and written English communication skills.

Responsabilités

• Develop and optimize laser release processes for advanced material transfer.
• Design, execute and analyse experiments to improve process performance and robustness.
• Perform hands‑on process development in the cleanroom and contribute to daily operation of the release process.
• Drive process maturity from exploratory research towards pilot‑line implementation.
• Analyse process data, identify improvement opportunities, and solve complex technical challenges.
• Present results and recommendations to project teams, management, industrial partners and customers.
• Collaborate closely with integration engineers, operations, equipment vendors and material experts.
• Act as the interface between the Material Transfer research team and the engineering organization, ensuring successful technology transfer into the pilot line.

Connaissances

Wafer bonding

Laser release

Layer transfer

Data interpretation

English communication

Formation

Master’s or PhD in Physics, Chemistry, Industrial or Materials Science

Outils

Matlab

Python

JMP

Description du poste

IMEC in Leuven, Belgium, invites applications for an R&D Release Technology Process Engineer to develop and optimize laser release processes for advanced material transfer and 3D integration concepts. You will work with cross‑functional teams to mature new release technologies into pilot‑line processes.

The role requires Master’s or PhD in a relevant field, experience with wafer bonding and laser release, and strong analytical and communication skills.