Optimization of SEM Cross-Section Preparation and Inspection

Imec; Vlaams-Brabant; Remote; EUR 6.700 - 13.000; Vollzeit

Zusammenfassung

imec in Belgium seeks a Master internship candidate to develop and optimize SEM cross-section inspection workflows. You will work on sample capping, cross-section cutting, and SEM imaging, evaluating imaging parameters to define objective image quality criteria from experiments.

You will also develop standardized patterns and beam templates to establish a robust, uniform SEM cross-section analysis methodology in a state-of-the-art semiconductor environment.

Qualifikationen

• Master internship candidate with relevant discipline.
• Self-supporting student status required.
• Eligible for internship in Belgium.

Aufgaben

• Develop and optimize a workflow for SEM cross-section inspections.
• Investigate and optimize sample capping, cross-section cutting, and SEM imaging.
• Evaluate imaging parameters such as pixel resolution, dwell time, line integration, and image integration.
• Define objective image quality criteria from experimental results.
• Develop standardized patterns and beam templates for robust SEM cross-section analysis.
• Collaborate with supervising scientist to apply findings in fabrication metrology.

Kenntnisse

SEM metrology familiarity

Ausbildung

Master student in Chemistry/Engineering/Physics

Tools

SEM Imaging Tools

Jobbeschreibung

/ Optimization of SEM Cross-Section Preparation and Inspection

Optimization of SEM Cross-Section Preparation and Inspection

Scanning Electron Microscopy (SEM) is anessential metrology technique in semiconductor

manufacturing, enabling high-resolutionimaging of device structures and material layers.

Both top-view and cross-sectional SEMinspections are widely used to monitor process

quality and support technology development.

This thesis focuses on developing andoptimizing a workflow for SEM cross-section

inspections. The student will investigateand optimize the key preparation and inspection

steps, including sample capping,cross-section cutting, and SEM imaging. Various imaging

parameters such as pixel resolution, dwelltime, line integration, and image integration will

be evaluated to determine their impact onimage quality.

Based on experimental results, objectiveimage quality criteria will be defined and used to

identify the optimal inspection conditions.The student will also develop standardized

pattern and beam templates to establish arobust and uniform methodology for SEM

cross-section analysis.

This project offers hands-on experiencewith advanced semiconductor metrology tools and

provides an opportunity to contributedirectly to the optimization of inspection methods

used in a state-of-the-art semiconductorfabrication environment

Type of internship: Master internship

Duration: 3 months

Required educational background: Chemistry/Chemical Engineering, Materials Engineering, Nanoscience & Nanotechnology, Physics

Supervising scientist(s): For further information or for application, please contact Felix Seidel ( [e-mail] )

The reference code for this position is 2026-INT-341. Mention this reference code in your application.

Only for self-supporting students.