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Imec invites Master or PhD interns to work on quantitative AFM nanomechanical metrology for advanced semiconductor patterning. The project focuses on measuring mechanical properties of thin films and pattern features in nanometre-scale regimes.
You will evaluate AFM approaches, study influences of film thickness and substrate, and develop an uncertainty-aware workflow for reliable data interpretation. Imec provides a supportive research environment.
/ Towards Quantitative AFM Nanomechanical Metrology for Advanced Semiconductor Patterning
You explore measurements of mechanical properties at the nanometre scale.
The continuousscaling of semiconductor technology isdriving increasingly small feature dimensions and pitches, enabled by advancedpatterning technologies such as high-NA EUVlithography. As critical dimensions (CDs) continue to shrink and materialstacks become increasingly complex, themechanical properties of photoresists, underlayers, and hard masks mayincreasingly influence pattern stability, roughness, defect formation, andpattern-transfer performance. This creates a growing need for metrologytechniques capable of measuring these properties at the relevant nanometrescale.
AFM-based nanomechanical characterization is particularly attractivebecause atomic force microscopy (AFM) can probe the local mechanical responsewhile simultaneously mapping surface topography at nanometre-scale samplingintervals. Depending on the measurement mode, the probed response may becontact stiffness, elastic modulus, adhesion, deformation, etc. However, turning thisnanomechanical contrast into reliable quantitative material properties remainschallenging because the measured response can depend on tip geometry, probecalibration, tip–sample contact mechanics, viscoelastic effects, applied loadand other measurement conditions. For ultrathin films and nanoscale patterns,substrate and edge effects can further influence the measured response.
Therefore, the goal of this Master’s thesis (internship) is to determinewhen AFM-based nanomechanical measurements can provide repeatable andquantitatively interpretable information, within a defined range of materials,film thicknesses, and sample geometries, for advanced semiconductor-patterningmaterials.
The student will:
The project will provide the student with hands-on experience inadvanced AFM techniques, nanoscale contact mechanics, experimental design,quantitative data analysis, and semiconductor-patterning metrology, whileaddressing a measurement challenge directly relevant to next-generationlithography.
Type of internship: Master internship, PhD internship
Duration: 6 months or 12 months (for students from NNFC program)
Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology, Materials Engineering
The reference code for this position is 2026-INT-322. Mention this reference code in your application.
Imec allowance will be provided.
The continuousscaling of semiconductor technology isdriving increasingly small feature dimensions and pitches, enabled by advancedpatterning technologies such as high-NA EUVlithography. As critical dimensions (CDs) continue to shrink and materialstacks become increasingly complex, themechanical properties of photoresists, underlayers, and hard masks mayincreasingly influence pattern stability, roughness, defect formation, andpattern-transfer performance. This creates a growing need for metrologytechniques capable of measuring these properties at the relevant nanometrescale.
AFM-based nanomechanical characterization is particularly attractivebecause atomic force microscopy (AFM) can probe the local mechanical responsewhile simultaneously mapping surface topography at nanometre-scale samplingintervals. Depending on the measurement mode, the probed response may becontact stiffness, elastic modulus, adhesion, deformation, etc. However, turning thisnanomechanical contrast into reliable quantitative material properties remainschallenging because the measured response can depend on tip geometry, probecalibration, tip–sample contact mechanics, viscoelastic effects, applied loadand other measurement conditions. For ultrathin films and nanoscale patterns,substrate and edge effects can further influence the measured response.
Therefore, the goal of this Master’s thesis (internship) is to determinewhen AFM-based nanomechanical measurements can provide repeatable andquantitatively interpretable information, within a defined range of materials,film thicknesses, and sample geometries, for advanced semiconductor-patterningmaterials.
The student will:
The project will provide the student with hands-on experience inadvanced AFM techniques, nanoscale contact mechanics, experimental design,quantitative data analysis, and semiconductor-patterning metrology, whileaddressing a measurement challenge directly relevant to next-generationlithography.
Type of internship: Master internship, PhD internship
Duration: 6 months or 12 months (for students from NNFC program)
Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology, Materials Engineering
Supervising scientist(s): For further information or for application, please contact Thomas Hantschel ( Thomas.Hantschel@imec.be ) and Gian Lorusso ( Gian.Lorusso@imec.be ) and Nemanja Peric ( Nemanja.Peric@imec.be )
The reference code for this position is 2026-INT-322. Mention this reference code in your application.
Imec allowance will be provided.