Fabrication and evaluation of diamond-tip chips for scanning probe microscopy

Imec

Vlaams-Brabant

À distance

EUR 12 000 - 19 000

Plein temps

Il y a 2 heures
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Résumé du poste

imec is offering a Master or PhD internship focused on fabricating and evaluating diamond-tip chips for scanning probe microscopy. You will develop and transfer a dry-etching process to a newer reactor, aiming for 8–12 µm silicon tips with 10–50 nm radii, and will coat tips with diamond films while evaluating performance in SPM labs.

The role includes lithography, etching, and deposition in imec’s state-of-the-art cleanroom, with results shared in a scientific publication.

Qualifications

  • Master or PhD internship in a related field is preferred.
  • Strong interest in micro/nano fabrication and SPM.
  • Ability to perform lithography, etching, and deposition in a cleanroom.

Responsabilités

  • Perform lithography, etching, and deposition in imec’s cleanroom.
  • Evaluate tip performance in a well-equipped SPM laboratory.
  • Summarize results in a scientific publication.

Formation

Electrotechnics/Electrical Engineering
Physics
Nanoscience & Nanotechnology
Materials Engineering

Outils

Lithography
Etching
Deposition
Cleanroom

Description du poste

/ Fabrication and evaluation of diamond-tip chips for scanning probe microscopy

Fabrication and evaluation of diamond-tip chips for scanning probe microscopy

You make tiny tip structures by micromachining for application in scanning probe microscopy.

Scanning probemicroscopy (SPM) is a powerful technique for characterizing materials and devices atthe nanometre scale , but the measurement quality depends directly on the SPM tip . Blunt,irregular, or multi-contact tips produce convolution artefacts that reduceaccuracy and require frequent replacement. Depending on the instrument,operating mode, and experimental environment, changing a tip can take from tenminutes to several hours. Extensive research has therefore focused on innovative solutions, with reverse tip sample (RTS) SPM , developed at imec , emerging as a aparticularly promising approach.

In RTS SPM, the sampleis placed on a tipless cantilever and is scanned over a tip integrated into theRTS tip chip, which contains thousands of such tips. This configuration allowsfor tip exchanges within a few seconds, a dramatic improvement compared totraditional SPM, simply by repositioning the sample above any adjacent, unusedtip. In just a few years, the RTS technology has further advanced and severalRTS tip chip prototypes tailored for different applications have been demonstrated.These include chips equipped with bare silicon tips for topographical mapping,platinum coated tips for electrical SPM, and conductive diamond tip variantsdesigned for high-force electrical measurements.

This project aims to improve the reproducibility and yield of an existing dry - etching process for silicon tip structures by transferring it froman older research etching tool to a newer , more advanced etchingreactor. Key target parameters are a silicon tip height of 8 – 12 µm, a tip-on-pedestalgeometry, and a tip radius of 10 – 50 nm . The fabricated silicon tips will be coated with thin diamond filmsand further patterned by dry etching. The project will also establish rigorous , efficient characterization methods to enable rapidfeedback and continuous process improvement. The student will performlithography, etching, and deposition in imec’s state-of-the-art cleanroom , evaluate tip performance in a well-equipped SPM laboratory, and summarize the results in a scientific publication.

Type of internship: Master internship, PhD internship

Duration: 6 months (or 12 months for NNFC students)

Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology, Materials Engineering

The reference code for this position is 2026-INT-347. Mention this reference code in your application.

Imec allowance will be provided.

Scanning probemicroscopy (SPM) is a powerful technique for characterizing materials and devices atthe nanometre scale , but the measurement quality depends directly on the SPM tip . Blunt,irregular, or multi-contact tips produce convolution artefacts that reduceaccuracy and require frequent replacement. Depending on the instrument,operating mode, and experimental environment, changing a tip can take from tenminutes to several hours. Extensive research has therefore focused on innovative solutions, with reverse tip sample (RTS) SPM , developed at imec , emerging as a aparticularly promising approach.

In RTS SPM, the sampleis placed on a tipless cantilever and is scanned over a tip integrated into theRTS tip chip, which contains thousands of such tips. This configuration allowsfor tip exchanges within a few seconds, a dramatic improvement compared totraditional SPM, simply by repositioning the sample above any adjacent, unusedtip. In just a few years, the RTS technology has further advanced and severalRTS tip chip prototypes tailored for different applications have been demonstrated.These include chips equipped with bare silicon tips for topographical mapping,platinum coated tips for electrical SPM, and conductive diamond tip variantsdesigned for high-force electrical measurements.

This project aims to improve the reproducibility and yield of an existing dry - etching process for silicon tip structures by transferring it froman older research etching tool to a newer , more advanced etchingreactor. Key target parameters are a silicon tip height of 8 – 12 µm, a tip-on-pedestalgeometry, and a tip radius of 10 – 50 nm . The fabricated silicon tips will be coated with thin diamond filmsand further patterned by dry etching. The project will also establish rigorous , efficient characterization methods to enable rapidfeedback and continuous process improvement. The student will performlithography, etching, and deposition in imec’s state-of-the-art cleanroom , evaluate tip performance in a well-equipped SPM laboratory, and summarize the results in a scientific publication.

The reference code for this position is 2026-INT-347. Mention this reference code in your application.

Imec allowance will be provided.

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