Optimization of TEM Chunk Preparation

Imec; Vlaams-Brabant; Presencial; EUR 8900 - 13.000; A tiempo parcial

Descripción de la vacante

Imec in Belgium is offering a bachelor internship focused on optimizing TEM chunk preparation for faster, higher-quality semiconductor analysis. You will work with advanced FIB tools to prepare lamellae and examine how ion beam voltage, current, and alignment affect milling speed and sample integrity.

This hands-on project combines experimental work with a solid theoretical understanding of FIB processing, aiming to define optimal settings and robust preparation workflows.

Formación

• Bachelor internship focusing on TEM sample prep optimization.
• Involves studying influence of ion beam voltage, current, alignment and wafer composition on milling speed.
• Requires background in chemistry, chemical engineering, bioscience engineering or materials engineering.

Responsabilidades

• Optimize TEM chunk preparation and lamella quality.
• Investigate effects of process parameters on milling rate and damage outside target pattern.
• Define optimal settings and preparation strategies for robust TEM analysis workflows.

Conocimientos

TEM preparation

Ion beam milling

Process parameter study

Metrology

Educación

Chemistry/Chemical Engineering

Bioscience Engineering

Materials Engineering

Herramientas

Focused Ion Beam (FIB)

Descripción del empleo

“Optimizing TEM sample preparation for faster, higher-quality semiconductor sample analysis.”

Transmission Electron Microscopy (TEM) is one of the mostpowerful characterization techniques used in semiconductor research andmanufacturing, providing detailed information on material structures and devicefeatures at the atomic scale. A critical first step in TEM analysis is thepreparation of TEM lamella, which begins with extracting a chunk from aspecific target region on a wafer.

This thesis focuses on optimizing the TEM chunk preparationprocess. The student will investigate the influence of key process parameters,including ion beam voltage, beam current, tool alignment, wafer composition,and feature dimensions. Through experimental work, the impact of theseparameters on milling speed and preparation quality will be evaluated.

The quality of the ion beam process will be assessed bydetermining milling rates and quantifying damage introduced outside theintended pattern area. In addition, the student will optimize patterndimensions and positioning to achieve the best balance between preparationspeed and sample quality.

Based on the results, optimal process settings andpreparation strategies will be defined to improve the efficiency and robustnessof TEM sample preparation. This project combines hands-on work with advancedsemiconductor equipment and a strong theoretical understanding of focused ionbeam (FIB) processing, offering the opportunity to contribute directly to theoptimization of TEM lamella preparation workflows in a state-of-the-artsemiconductor environment.

Type of internship: Bachelor internship

Required educational background: Chemistry/Chemical Engineering, Bioscience Engineering, Materials Engineering

Supervising scientist(s): For further information or for application, please contact Felix Seidel ( [e-mail] )

The reference code for this position is 2026-INT-268. Mention this reference code in your application.

Optimization of TEM Chunk Preparation