Staff Engineer Simulation and Package Design Methodology (f/m/div)

Infineon Technologies; Villach; Vor Ort; EUR 70.000 - 110.000; Vollzeit

Zusammenfassung

Infineon Technologies Austria in Villach seeks an engineer to develop and support simulation methodologies, design flows, and tool environments for CPB co-design in a Linux-based HPC setting. You will drive improvements in electromagnetic, thermal and multiphysics analysis for semiconductor package and system development.

Join a global team delivering simulation-driven design for advanced packaging. You will own the CPB co-design environment, consult on projects worldwide, and collaborate across

Qualifikationen

• Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or related technical field.
• 4+ years in semiconductor package development, simulation, or related engineering.
• Strong background in electromagnetic, thermal, or multiphysics simulation for package/system development.
• Hands-on with industry-standard simulators such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL.
• Proven track record in developing and deploying simulation methodologies and engineering workflows.
• Solid Linux knowledge and programming skills (Python, bash, MATLAB, Perl).
• Fluent English; German a plus; strong analytic and customer-oriented mindset.
• Experience with ML/AI tools for design or simulation is advantageous.

Aufgaben

• Develop and support simulation methodologies, design flows, and tool environments for CPB co-design in Linux-based HPC environment.
• Drive and improve methodologies for electromagnetic, thermal and multiphysics analysis for semiconductor package and system development.
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting to projects worldwide.
• Enable simulation-driven design and verification for advanced packaging technologies including SiP, heterogeneous integration, 2.5D/3D solutions.
• Collaborate with Business Lines, Design Systems, and external partners to address simulation needs and develop engineering solutions.
• Lead technology evaluations, benchmarks, automation initiatives, and knowledge sharing to improve capabilities and productivity.

Kenntnisse

CPB Co-Design

Electromagnetic

Thermal simulation

Multiphyysics

Python

Linux

ML/AI tools

Communication skills

English fluent

Ausbildung

Electrical Engineering

Microelectronics

Physics

Computational Engineering

Mechanical Engineering

Tools

Synopsys/Ansys

Cadence

Siemens

Keysight

COMSOL

Linux scripting

Jobbeschreibung

Your Role

• Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment
• Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide
• Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions
• Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in‑class engineering solutions
• Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity

Qualifications And Skills To Help You Succeed

• Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline
• At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development
• Hands‑on experience with industry‑standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms
• Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments
• Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill
• Strong analytical and problem‑solving skills combined with excellent communication abilities and a customer‑oriented mindset
• Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage
• Fluent English skills are required; German language skills are considered as an advantage

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

Click here for more information about Diversity & Inclusion at Infineon.