Senior Staff Engineer Chip Package Board - CoDesign Flow and Methodology (f/m/div)

Infineon Technologies AG; Villach; On-site; EUR 90,000 - 120,000; Full time

Job summary

Infineon Technologies AG in Austria invites an experienced Staff Engineer to shape next‑gen CPB co‑design methodologies and simulation‑driven packaging. You will develop and support CPB co‑design flows, enable multi‑physics simulations, and drive tool environments in Linux‑based HPC settings.

You will collaborate with business lines and design teams worldwide, own the simulation environment, mentor engineers, and push automation and ML/AI integration for increasingly complex packaging

Qualifications

• Must have a degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering or Mechanical Engineering.
• At least 4 years of professional experience in semiconductor package development, simulation, or related engineering fields.
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development.

Responsibilities

• Develop and support simulation methodologies, design flows, and tool environments for CPB Co-Design and advanced package development in Linux-based HPC environment.
• Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development.
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide.
• Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions.
• Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutions.
• Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity.

Skills

Electromagnetic simulation

Thermal simulation

Multiphysics simulation

Linux

Python

MATLAB

Bash

Perl

Education

Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering

Tools

Synopsys/Ansys

Cadence

Siemens

Keysight

COMSOL

Job description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Staff Engineer Simulation and Package Design Methodology on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Key Responsibilities

• Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment
• Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide
• Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions
• Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutions
• Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity

Your Profile

• Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline
• At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development
• Hands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms
• Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments
• Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill
• Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset
• Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage
• Fluent English skills are required; German language skills are considered as an advantage

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.

Company Culture & Inclusion

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, and smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are.

At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills.