Staff Engineer Simulation and Package Design Methodology (f/m/div)

Infineon Technologies AG; Villach; Vor Ort; EUR 70.000 - 110.000; Vollzeit

Zusammenfassung

Infineon Technologies AG in Austria seeks a Staff Engineer specializing in Simulation and Package Design Methodology. You will develop and support CPB co-design simulation flows, EM/thermal/multiphysics analyses, and maintain the Linux-based tool environment to enable simulation-driven design.

You will partner with design teams worldwide, evaluate new methodologies, and drive automation to boost engineering productivity. Fluent English required; German a plus.

Qualifikationen

• 4+ years of professional experience in semiconductor package development, simulation, design methodologies, or related engineering fields.
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development.
• Hands-on experience with Linux and CPB design toolchains.

Aufgaben

• Develop and support simulation methodologies, design flows, and tool environments for CPB co-design.
• Drive improved multidisciplinary analyses (electromagnetic, thermal, multiphysics) for package and system development.
• Own and maintain the CPB Co-Design Flow and provide consulting to product projects worldwide.
• Enable simulation-driven design for 2.5D/3D packaging and SiP technologies.
• Collaborate with Business Lines and external partners to address simulation needs and build best-in-class solutions.
• Lead benchmarks, automation initiatives, and knowledge sharing to enhance simulation capabilities.

Kenntnisse

Python

Bash

MATLAB

Perl

Ausbildung

Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or related technical discipline

Tools

Synopsys/Ansys

Cadence

Siemens

Keysight

COMSOL

Jobbeschreibung

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Staff Engineer Simulation and Package Design Methodology on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Key Responsibilities

• Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment
• Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide
• Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions
• Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutions
• Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity

Your Profile

• Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline
• At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development
• Hands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms
• Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments
• Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill
• Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset
• Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage
• Fluent English skills are required; German language skills are considered as an advantage

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.

Company Culture & Inclusion

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, and smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are.

At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills.