Senior Scientist - Advanced Photonic Packaging (2.5D/3D)

Silicon Austria Labs GmbH; Villach; On-site; EUR 59,000 - 72,000; Full time

Benefits offered by this job

Relocation support

Vital4SAL program

Meal allowance (€4/day)

Job summary

Silicon Austria Labs GmbH in Villach is seeking a Senior Scientist – Package design engineer to lead R&D in advanced packaging platforms (2.5D/3D), Si/RDL interposers and TSV integration. You will collaborate with international partners, publish papers, and contribute to funding proposals.

A MSc or PhD in Electrical Engineering and hands-on cleanroom experience are required. SAL offers a competitive salary starting at 65,000 EUR per year, relocation support, extensive training, and

Qualifications

• MSc or PhD in Electrical Engineering or a related field.
• Strong expertise in WLCSP design and IC-Package-PCB co-design.
• Hands-on experience in cleanroom processing and microfabrication workflows.
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
• Solid understanding of, and practical experience in, TSV/TGV processing.
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques.
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
• Experience of working with photonic assemblies and optical testing/characterisation.
• Fluency in English; German is a plus.

Responsibilities

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Skills

WLCSP design

IC-Package-PCB co-design

Cleanroom processing

Microfabrication

2.5D/3D packaging

TSV processing

Photonic packaging

Co-packaged optics

Optical alignment

Heterogeneous integration

Chiplets

Proposal writing

English fluency

Education

MSc or PhD in Electrical Engineering or related field

Job description

Silicon Austria Labs GmbH in Villach is seeking a Senior Scientist – Package design engineer to lead R&D in advanced packaging platforms (2.5D/3D), Si/RDL interposers and TSV integration. You will collaborate with international partners, publish papers, and contribute to funding proposals.

A MSc or PhD in Electrical Engineering and hands-on cleanroom experience are required. SAL offers a competitive salary starting at 65,000 EUR per year, relocation support, extensive training, and