Packaging Scientist for 2.5D/3D Interposers & Photonics

Silicon Austria Labs (SAL); Villach; Vor Ort; EUR 59.000 - 72.000; Vollzeit

Benefits dieser Stelle

Relocation support

Career development

Work and Family Certificate

Zusammenfassung

Silicon Austria Labs (SAL) in Austria seeks a researcher to advance heterogeneous integration and packaging platforms. You will design interposers, lead R&D projects, and collaborate with industry and academia to publish results and drive patents.

The candidate should have MSc/PhD in EE, hands-on cleanroom experience, and strong English skills (German a plus). SAL offers relocation support, training, and a family-friendly environment.

Qualifikationen

• MSc or PhD in Electrical Engineering or a related field.
• Strong expertise in WLCSP design and IC–Package–PCB co-design.
• Hands-on experience in cleanroom processing and microfabrication workflows.
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
• Solid understanding of TSV/TGV processing.
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques.
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
• Experience with photonic assemblies and optical testing/characterisation.
• Strong analytical skills and a structured approach to problem solving.
• Experience in collaborative R&D projects and proposal writing.
• Fluency in English; German is a plus.

Aufgaben

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Kenntnisse

WLCSP design

IC–Package–PCB co-design

Cleanroom processing

Microfabrication workflows

Interposer design

2.5D integration

TSV processing

Photonic packaging

Optical alignment

Heterogeneous integration

Chiplets

Proposal writing

English fluency

Ausbildung

MSc or PhD in Electrical Engineering or related field

Jobbeschreibung

Silicon Austria Labs (SAL) in Austria seeks a researcher to advance heterogeneous integration and packaging platforms. You will design interposers, lead R&D projects, and collaborate with industry and academia to publish results and drive patents.

The candidate should have MSc/PhD in EE, hands-on cleanroom experience, and strong English skills (German a plus). SAL offers relocation support, training, and a family-friendly environment.