Staff Engineer: 3D TSV Process & Integration Leader

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Premstätten; Hybrid; EUR 90,000 - 130,000; Full time

Job summary

ams OSRAM AG in Austria seeks a specialist to advance wafer-level integration, collaborating with internal and external fabs to design and implement process modules.

You will lead projects, define experiments, analyze data, and document results while ensuring quality and timely delivery. The candidate should have an advanced degree and strong TSV/3D integration experience, with excellent English communication and teamwork.

Qualifications

• Advanced university degree (Master’s or PhD) in Physics, Chemistry, or a related discipline.
• Strong understanding of TSVs with focus on development, integration and industrialization of process modules.
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking for 3D/heterogeneous integration concepts.

Responsibilities

• Develop manufacturing process modules in collaboration with internal and external Fabs, from concept design through implementation.
• Take ownership of projects or work packages and lead sub-teams within larger projects.
• Definition, implementation, analysis and documentation of experiments.
• Solve problems during process development and make technical decisions within projects.
• Collaborate in a team-oriented environment with emphasis on quality and timely execution.

Skills

TSV development

3D integration concepts

Team collaboration

Data-driven reporting

Education

Master's or PhD in Physics/Chemistry or related field

Tools

Wafer-to-Wafer bonding

Die-to-Wafer stacking

Job description

ams OSRAM AG in Austria seeks a specialist to advance wafer-level integration, collaborating with internal and external fabs to design and implement process modules.

You will lead projects, define experiments, analyze data, and document results while ensuring quality and timely delivery. The candidate should have an advanced degree and strong TSV/3D integration experience, with excellent English communication and teamwork.