Interposer Design Engineer - 2.5D/3D Packaging

Silicon Austria Labs GmbH; Faak am See; Vor Ort; EUR 59.000 - 72.000; Vollzeit

Benefits dieser Stelle

Relocation support

Work & Family Certificate

Training opportunities

Meal allowance

Zusammenfassung

Silicon Austria Labs (SAL) is seeking a researcher to advance 2.5D/3D interposers and photonic-electronic integration. You will design, fabricate, and optimize Si/RDL interposers and packaging strategies, contributing to project leadership and high-impact publications.

The role requires hands-on microfabrication experience, strong analytical skills, and fluency in English (German a plus). SAL offers relocation support, training, and a family-friendly environment in Austria.

Qualifikationen

• MSc or PhD in Electrical Engineering or a related field.
• Strong expertise in WLCSP design and IC–Package–PCB co-design.
• Hands-on experience in cleanroom processing and microfabrication workflows.
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
• Solid understanding of, and practical experience in, TSV/TGV processing.
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques.
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
• Experience of working with photonic assemblies and optical testing/characterisation.
• Strong analytical skills and a structured approach to problem solving.
• Experience in collaborative R&D projects and proposal writing.
• Fluency in English; German is a plus.

Aufgaben

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Kenntnisse

WLCSP design

IC–Package–PCB co-design

Cleanroom processing

2.5D interposer design

TSV processing

Photonic packaging

Optical alignment

R&D collaboration

English fluency

Ausbildung

MSc/PhD in Electrical Engineering

Tools

Cleanroom equipment

Microfabrication workflows

Jobbeschreibung

Silicon Austria Labs (SAL) is seeking a researcher to advance 2.5D/3D interposers and photonic-electronic integration. You will design, fabricate, and optimize Si/RDL interposers and packaging strategies, contributing to project leadership and high-impact publications.

The role requires hands-on microfabrication experience, strong analytical skills, and fluency in English (German a plus). SAL offers relocation support, training, and a family-friendly environment in Austria.