Scientist - Package design engineer (all genders)

Silicon Austria Labs GmbH; Faak am See; Vor Ort; EUR 59.000 - 72.000; Vollzeit

Benefits dieser Stelle

Relocation support

Work & Family Certificate

Training opportunities

Meal allowance

Zusammenfassung

Silicon Austria Labs (SAL) is seeking a researcher to advance 2.5D/3D interposers and photonic-electronic integration. You will design, fabricate, and optimize Si/RDL interposers and packaging strategies, contributing to project leadership and high-impact publications.

The role requires hands-on microfabrication experience, strong analytical skills, and fluency in English (German a plus). SAL offers relocation support, training, and a family-friendly environment in Austria.

Qualifikationen

• MSc or PhD in Electrical Engineering or a related field.
• Strong expertise in WLCSP design and IC–Package–PCB co-design.
• Hands-on experience in cleanroom processing and microfabrication workflows.
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
• Solid understanding of, and practical experience in, TSV/TGV processing.
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques.
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
• Experience of working with photonic assemblies and optical testing/characterisation.
• Strong analytical skills and a structured approach to problem solving.
• Experience in collaborative R&D projects and proposal writing.
• Fluency in English; German is a plus.

Aufgaben

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Kenntnisse

WLCSP design

IC–Package–PCB co-design

Cleanroom processing

2.5D interposer design

TSV processing

Photonic packaging

Optical alignment

R&D collaboration

English fluency

Ausbildung

MSc/PhD in Electrical Engineering

Tools

Cleanroom equipment

Microfabrication workflows

Jobbeschreibung

Are you ready to shape the future of advanced -packaging platformsand high-speed data communication? Join our heterogeneous integration team and drive the development of advanced interposers for next-generation of photonic-electronic systems.

Your future tasks include:

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Your profile:

• MSc or PhD in Electrical Engineering or a related field
• Strong expertise in WLCSP design and IC–Package–PCB co-design
• Hands-on experience in cleanroom processing and microfabrication workflows
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration
• Solid understanding of, and practical experience in, TSV/TGV processing
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts
• Experience of working with photonic assemblies and optical testing/characterisation
• Strong analytical skills and a structured approach to problem solving
• Experience in collaborative R&D projects and proposal writing
• Fluency in English; German is a plus

Important Facts about SAL:

• Diverse research activities with many technical challenges.
• State-of-the-art laboratory facilities and equipment.
• Location in the heart of Europe in Austria – relocation support for non-European nationalities.
• Internal and external training opportunities for career development.
• Family & children friendly - actively shaping the compatibility of family and career.
• “Vital4SAL” to promote a healthy workplace (e.g. SAL coaching pool, trainings on mental health, physical activities, healthy snacks, 24/7 accident insurance)
• € 4 per day meal allowance in restaurants or € 2 per working day in supermarkets.
• Public transport initiative (subsidy for the “Klimaticket”)
• Our values: Open door policy, flexibility in working hours, casual dress code, diverse teams, working with people of different nationalities, informal communication, lifelong learning, compatibility of family and career, sustainability, personal growth, and collective advancement.

This position is subject to the Collective Agreement for employees in non-university research (Research CA) starting in occupational group E (E1 salary = EUR 4.056, paid 14 times a year) based on 38,5 hours per week). For this position we offer competitive salaries and additional benefits based on your experience and qualifications, starting with a minimum gross salary of EUR 65.000 (annual, based on an All-in contract).

About us:

Silicon Austria Labs (SAL) is a top research center for Electronics and Software Based Systems (ESBS). At three locations (Graz, Villach, Linz), SAL is conducting research along the entire ESBS value chain in the areas of sensor systems, power electronics, intelligent wireless systems, microsystems and embedded systems to develop future-oriented solutions for industrial production, health, energy, mobility, safety and more. SAL brings together key players from industry, science and research and thus valuable expertise and know-how and conducts cooperative, application-oriented research along the value chain. Cooperative projects are co-financed by SAL and enable a fast and unbureaucratic project start. SAL is thus shaping the high-tech location Austria and Europe and developing the future.

Innovation is our top priority and so are our employees. We are a family-friendly company and support the compatibility of work and family as much as possible. That is why we have been awarded the Work and Family Certificate until 2026. But we are constantly working on new measures to offer our employees an environment where they feel good, healthy and motivated.