Senior Scientist - Package design engineer

Silicon Austria Labs GmbH

Villach

On-site

EUR 59,000 - 72,000

Full time

14 days+
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Benefits offered by this job

Relocation support
Vital4SAL program
Meal allowance (€4/day)

Job summary

Silicon Austria Labs GmbH in Villach is seeking a Senior Scientist – Package design engineer to lead R&D in advanced packaging platforms (2.5D/3D), Si/RDL interposers and TSV integration. You will collaborate with international partners, publish papers, and contribute to funding proposals.

A MSc or PhD in Electrical Engineering and hands-on cleanroom experience are required. SAL offers a competitive salary starting at 65,000 EUR per year, relocation support, extensive training, and

Qualifications

  • MSc or PhD in Electrical Engineering or a related field.
  • Strong expertise in WLCSP design and IC-Package-PCB co-design.
  • Hands-on experience in cleanroom processing and microfabrication workflows.
  • Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
  • Solid understanding of, and practical experience in, TSV/TGV processing.
  • Experience in photonic packaging and co-packaged optics integration is highly desirable.
  • Familiarity with passive and active optical alignment techniques.
  • Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
  • Experience of working with photonic assemblies and optical testing/characterisation.
  • Fluency in English; German is a plus.

Responsibilities

  • Research and development of advanced packaging platforms (2.5D and 3D).
  • Design and fabrication of Si/RDL interposers for photonic-electronic integration.
  • Development of assembly design kits (ADK).
  • Process development and integration of TSV fabrication into interposer platforms.
  • Data analysis, modeling, and process optimization.
  • Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
  • Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
  • Preparation of technical reports, scientific publications, and presentations.
  • Preparation and submission of research funding proposals.

Skills

WLCSP design
IC-Package-PCB co-design
Cleanroom processing
Microfabrication
2.5D/3D packaging
TSV processing
Photonic packaging
Co-packaged optics
Optical alignment
Heterogeneous integration
Chiplets
Proposal writing
English fluency

Education

MSc or PhD in Electrical Engineering or related field

Job description

Senior Scientist - Package design engineer (all genders)

Villach | Fulltime | Published: 21.08.2026

Your future tasks include:
  • Research and development of advanced packaging platforms (2.5D and 3D).
  • Design and fabrication of Si/RDL interposers for photonic-electronic integration.
  • Development of assembly design kits (ADK).
  • Process development and integration of TSV fabrication into interposer platforms.
  • Data analysis, modeling, and process optimization.
  • Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
  • Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
  • Preparation of technical reports, scientific publications, and presentations.
  • Preparation and submission of research funding proposals.
Your profile:
  • MSc or PhD in Electrical Engineering or a related field
  • Strong expertise in WLCSP design and IC-Package-PCB co-design
  • Hands-on experience in cleanroom processing and microfabrication workflows
  • Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration
  • Solid understanding of, and practical experience in, TSV/TGV processing
  • Experience in photonic packaging and co-packaged optics integration is highly desirable.
  • Familiarity with passive and active optical alignment techniques
  • Knowledge of heterogeneous integration, chiplets and advanced packaging concepts
  • Experience of working with photonic assemblies and optical testing/characterisation
  • Strong analytical skills and a structured approach to problem solving
  • Experience in collaborative R&D projects and proposal writing
  • Fluency in English; German is a plus
Important Facts about SAL:
  • Diverse research activities with many technical challenges.
  • State-of-the‑art laboratory facilities and equipment.
  • Location in the heart of Europe in Austria - relocation support for non‑European nationalities.
  • Internal and external training opportunities for career development.
  • Family & children friendly - actively shaping the compatibility of family and career.
  • "Vital4SAL" to promote a healthy workplace (e.g. SAL coaching pool, trainings on mental health, physical activities, healthy snacks, 24/7 accident insurance)
  • € 4 per day meal allowance in restaurants or € 2 per working day in supermarkets.
  • Public transport initiative (subsidy for the "Klimaticket")
  • Our values: Open door policy, flexibility in working hours, casual dress code, diverse teams, working with people of different nationalities, informal communication, lifelong learning, compatibility of family and career, sustainability, personal growth, and collective advancement.

This position is subject to the Collective Agreement for employees in non-university research (Research CA) starting in occupational group E (E1 salary = EUR 4.056, paid 14 times a year) based on 38,5 hours per week). For this position we offer competitive salaries and additional benefits based on your experience and qualifications, starting with a minimum gross salary of EUR 65.000 (annual, based on an All‑in contract).

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