Package Development Engineer (d/m/f)

ams-OSRAM AG; Oberpremstätten; On-site; EUR 90,000 - 120,000; Full time

Benefits offered by this job

Competitive salary

Performance-based pay

Travel opportunities

Job summary

ams-OSRAM AG in Austria’s Steiermark invites a senior packaging engineer to lead advanced semiconductor packaging projects for digital photonics and consumer electronics. You will design and optimize packages, perform mechanical/optical design and BOM management, and collaborate across IC design, QA, and manufacturing teams.

In this role you will drive development to completion within resource constraints, explore new materials and suppliers, and contribute to continuous tech improvements for

Qualifications

• Advanced degree in a relevant technical field and extensive packaging experience.
• Experience with high-volume semiconductor packaging and MEMS/CMOS knowledge is a plus.
• Ability to model and draw components using SolidWorks or AutoCAD.

Responsibilities

• Develop packages and package technologies for digital photonics and sensors.
• Perform mechanical/optical design, BOMs, and simulations with partners.
• Interface with IC design, QA, assembly, test, and product teams.
• Drive on-time, on-budget package development to completion.
• Identify cost-improvement opportunities for high-volume production.

Skills

Strong communication

Analytical thinking

Problem solving

Fluent in English

Travel willingness

Education

Advanced degree in Physics/ Chemistry/ Materials Science/ Optics/ Engineering

10+ years semiconductor packaging experience

Tools

SolidWorks

AutoCAD

Job description

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

• Develop packages & package technologies for digital photonics (datacom, AR/VR) and optical sensors (ambient light, color, proximity) as part of the engineering team
• Carry out package design (mechanical & optical design, bill of materials, simulations) and manufacturing at assembly partners
• Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams
• Execute package development to successful completion within given resource constraints (time, budget)
• Continuously improve package technologies to achieve time, quality and cost targets
• Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality
• Identify and introduce cost improvements for high volume production
• Identify and develop new suppliers / technologies

• Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
• 10 year+ experience in advanced semiconductor packaging
• Technical modelling and drawing in SolidWorks and AutoCAD beneficial
• Experience in high volume manufacturing for consumer electronics applications is a benefit
• Experience in collaboration with external manufacturing partners (OSATs)
• Failure analysis and reliability engineering knowledge, basic knowledge of MEMS and CMOS manufacturing technologies
• Demonstrated analytical and problem‑solving skills, hands‑on‑mentality, ability to execute developments within tight resource constraints (time, budget)
• Ability to cope with high workloads in critical project stages and collaborate with diverse teams in multiple geographical locations
• Strong communication skills, creativity and problem‑solving skills
• Openness to business travel for several weeks per year
• Fluent in English

• We offer competitive salaries and additional benefits based on your performance, experience and qualification.
• The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
• We offer a higher compensation depending on your expertise and skills.