Lead Package Development Engineer - Photonic Packaging

ams-OSRAM AG; Premstätten; Remote; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Competitive salary

Performance-based benefits

Job summary

ams-OSRAM AG is seeking a Senior Packaging Engineer to develop packages and technologies for digital photonics and optical sensors. You will handle mechanical and optical design, BOMs, and simulations while collaborating with IC design, quality, and production teams across multiple sites.

The role demands an advanced degree in physics/chemistry/materials science or related engineering, extensive packaging experience, and strong analytical and communication skills.

Qualifications

• Advanced degree required in a relevant field.
• Demonstrated analytical and problem-solving skills.
• Fluent in English; strong communication abilities.

Responsibilities

• Develop packages and package technologies for digital photonics and optical sensors.
• Design mechanical and optical package aspects, BOMs, and run simulations with partners.
• Interface with IC design, QA, assembly, test, PM, and application teams across sites.

Skills

Communication

Analytical thinking

Problem solving

Fluent in English

Education

Advanced university degree in Physics/Chemistry/Materials Science/Optics/Polymer or Mechanical/Semiconductor Engineering

Tools

SolidWorks

AutoCAD

Job description

ams-OSRAM AG is seeking a Senior Packaging Engineer to develop packages and technologies for digital photonics and optical sensors. You will handle mechanical and optical design, BOMs, and simulations while collaborating with IC design, quality, and production teams across multiple sites.

The role demands an advanced degree in physics/chemistry/materials science or related engineering, extensive packaging experience, and strong analytical and communication skills.