Package Development Engineer (d/m/f)

ams-OSRAM AG; Premstätten; Remote; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Competitive salary

Performance-based benefits

Job summary

ams-OSRAM AG is seeking a Senior Packaging Engineer to develop packages and technologies for digital photonics and optical sensors. You will handle mechanical and optical design, BOMs, and simulations while collaborating with IC design, quality, and production teams across multiple sites.

The role demands an advanced degree in physics/chemistry/materials science or related engineering, extensive packaging experience, and strong analytical and communication skills.

Qualifications

• Advanced degree required in a relevant field.
• Demonstrated analytical and problem-solving skills.
• Fluent in English; strong communication abilities.

Responsibilities

• Develop packages and package technologies for digital photonics and optical sensors.
• Design mechanical and optical package aspects, BOMs, and run simulations with partners.
• Interface with IC design, QA, assembly, test, PM, and application teams across sites.

Skills

Communication

Analytical thinking

Problem solving

Fluent in English

Education

Advanced university degree in Physics/Chemistry/Materials Science/Optics/Polymer or Mechanical/Semiconductor Engineering

Tools

SolidWorks

AutoCAD

Job description

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

• Develop packages & package technologies for digital photonics (datacom, AR/VR) and optical sensors (ambient light, color, proximity) as part of the engineering team
• Carry out package design (mechanical & optical design, bill of materials, simulations) and manufacturing at assembly partners
• Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams
• Execute package development to successful completion within given resource constraints (time, budget)
• Continuously improve package technologies to achieve time, quality and cost targets
• Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality
• Identify and introduce cost improvements for high volume production
• Identify and develop new suppliers / technologies

• Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
• 10 year+ experience in advanced semiconductor packaging
• Technical modelling and drawing in SolidWorks and AutoCAD beneficial
• Experience in high volume manufacturing for consumer electronics applications is a benefit
• Experience in collaboration with external manufacturing partners (OSATs)
• Failure analysis and reliability engineering knowledge, basic knowledge of MEMS and CMOS manufacturing technologies
• Demonstrated analytical and problem‑solving skills, hands‑on‑mentality, ability to execute developments within tight resource constraints (time, budget)
• Ability to cope with high workloads in critical project stages and collaborate with diverse teams in multiple geographical locations
• Strong communication skills, creativity and problem‑solving skills
• Openness to business travel for several weeks per year
• Fluent in English

• We offer competitive salaries and additional benefits based on your performance, experience and qualification.
• The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
• We offer a higher compensation depending on your expertise and skills.