MWP Process Engineer (d/m/f)

ams-OSRAM AG; Unterpremstätten; Vor Ort; EUR 55.000 - 75.000; Vollzeit

Zusammenfassung

ams-OSRAM AG is seeking a technically skilled professional to own mechanical wafer processing, including backgrinding, bonding, sawing and debonding. You will apply SPC/FDC to maintain process performance and support productivity in in-house production.

Ideal candidates hold an HTL and show strong analytical abilities, ownership, and the ability to work in cross-functional teams. Weekend availability may be required.

Qualifikationen

• HTL or higher technical education completed.
• Knowledge of quality requirements (5S, etc.).
• Strong analytical and technical capabilities.

Aufgaben

• Single process ownership in mechanical wafer processing (backgrinding, temporary/permanent bonding, sawing and debonding).
• Maintain single process performance by applying SPC and FDC techniques.
• Support productivity goals of our in-house production.
• (re-)qualification of single processes.
• Maintain related controlled documents (control plan; FMEA; Workstation Procedure).
• Gain and further improve in-depth single process knowledge.
• Support single process development and identify improvements.

Kenntnisse

5S basics

Ownership

Cross-functional teamwork

Technical & analytical skills

German and English communication

Ausbildung

HTL (higher technical college)

Jobbeschreibung

Requisition ID24332-Posted09/22/2026

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting‑edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.
Find out more about us on https://ams-osram.com

Your new responsibilities

• Single process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing and debonding
• Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
• Support productivity goals of our in-house production
• (re-) qualification of single processes
• Maintain related controlled documents - e.g., control plan; Failure Mode and Effects Analysis (FMEA), Workstation Procedure (WSP); etc. & general documentation
• Gain and further improve in-depth single process knowledge
• Support of single process development
• Identify and drive single process improvements

Who we are looking for

• Finished education in a technical field, such as physics, chemistry, process technology, etc. (minimum requirement: “HTL (higher technical college)”; higher academical grades appreciated)
• Understanding of basic quality requirements (5S, etc.)
• Taking ownership, working pro-actively & independent
• Working in technical and cross-functional teams
• Excellent technical & analytical skills
• Availability for weekend shifts
• Very good communication skills in German and English

We offer competitive salaries and additional benefits based on your performance, experience and qualification.