High-Frequency RFIC Package & PCB Layout Engineer

ams-OSRAM AG; Oberpremstätten; Presencial; EUR 70.000 - 90.000; Jornada completa

Descripción de la vacante

ams OSRAM AG in Austria is seeking an experienced RF/High-Frequency IC layout engineer to develop substrate and PCB layouts for sensor and mixed-signal applications. You will optimize for SI/PI and RF performance while collaborating with EMC, analog, package, and IC teams.

The role requires 6+ years in the semiconductor industry, strong Cadence Allegro and Altium skills, and expertise in controlled impedance routing, EM concepts, and parasitic control. English is essential; German is beneficial.

Formación

• Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or related field.
• Minimum 6 years of experience in Semiconductor/Electronic Industry.
• Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer.
• Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS is highly desirable.
• Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is a strong benefit.
• Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks.
• Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging.
• CMOS IC layout experience is highly desirable, providing expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design.
• Good technical English is a must; German is beneficial.

Responsabilidades

• Design and develop RF and high-frequency IC substrate and PCB layouts for sensor and mixed-signal applications.
• Perform RF-aware component placement and transmission line routing, including CPW, microstrip, and stripline implementations.
• Optimize layout for signal integrity (SI), power integrity (PI), and RF performance.
• Create and maintain package substrate and PCB layouts using Cadence Allegro Suite and Altium Designer including libraries and constraints.
• Collaborate with EMC, analog, package, and IC design engineers for chip-package-board co-design and support SI/PI/EM extraction tools.
• Perform design verification and manufacturability reviews, including DRC/ERC checks.
• Supplier selection and qualification for PCB and SMT.

Conocimientos

RF layout

Signal integrity

German language helpful

English language

Grounding & shielding

Parasitic control

Educación

Bachelor's or Master's Degree in Electrical Engineering/related field

Herramientas

Cadence Allegro Suite

Allegro X/APD/Package Designer

Altium Designer

Cadence Virtuoso

Siemens Calibre / PVS

Descripción del empleo

ams OSRAM AG in Austria is seeking an experienced RF/High-Frequency IC layout engineer to develop substrate and PCB layouts for sensor and mixed-signal applications. You will optimize for SI/PI and RF performance while collaborating with EMC, analog, package, and IC teams.

The role requires 6+ years in the semiconductor industry, strong Cadence Allegro and Altium skills, and expertise in controlled impedance routing, EM concepts, and parasitic control. English is essential; German is beneficial.