Wafer-Level IC Packaging Engineer — 2.5D/3D Innovator

Socket.dev; California (MO); On-site; USD 90,000 - 130,000; Full time

Job summary

Socket.dev is seeking an IC Packaging Engineer to contribute to package concept exploration and configuration studies. You will support prototype evaluations and drive process development toward MP readiness, partnering with design, test, reliability, and product teams as well as foundry and OSAT partners.

Join a team that values curious, detail-oriented engineers who can grow into end-to-end ownership of characterization, modeling, and failure analysis across SoC packaging projects.

Qualifications

• Bachelor's degree required in a relevant field.
• Familiarity with wafer level packaging, 2.5D/3D packaging, and reliability standards.
• Experience or internship in semiconductor packaging environments is preferred.

Responsibilities

• Support package concept exploration and configuration studies.
• Assist prototype evaluations and process development toward mass-production readiness.
• Collaborate with design, test, reliability, and product teams, plus foundry and OSAT partners.
• Grow into end-to-end ownership of deliverables across characterization, modeling and FA.

Skills

Cross-functional collaboration

Engineering physics fundamentals

Independent project management

Strong problem solving

Education

Bachelor's degree in a relevant field

Tools

SEM

EDX

CSAM

FTIR

DMA

TMA

Job description

Socket.dev is seeking an IC Packaging Engineer to contribute to package concept exploration and configuration studies. You will support prototype evaluations and drive process development toward MP readiness, partnering with design, test, reliability, and product teams as well as foundry and OSAT partners.

Join a team that values curious, detail-oriented engineers who can grow into end-to-end ownership of characterization, modeling, and failure analysis across SoC packaging projects.