Wafer Architect

Conductor; Austin, Boston, San Francisco (TX, MA, CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Conductor seeks an architect to own the logical architecture for the A-0 and A-1 wafer products. You will collaborate with the XPU/Compute chip architect and memory architect to synthesize the final wafer-level architecture.

The ideal candidate has deep hands-on experience in AI chip design (GPUs, TPUs, XPUs, ASICs) and strong knowledge of memory subsystems in multi-die configurations, with an emphasis on LLM inference workloads from software to hardware implications.

Qualifications

• Deep understanding of AI chip design processes (GPUs, TPUs, XPUs, ASICs).
• Knowledge of memory subsystems in multi-die systems.
• Understanding of software aspects of LLM inference and its hardware implications.

Responsibilities

• Own the logical architecture for A-0 and A-1 wafer products.
• Collaborate with XPU/Compute chip architect and memory architect to synthesize wafer-level architecture.
• Spearhead architectural partitioning and workload distribution across dies and chip packages.

Skills

AI chip architecture

Multi-die design

LLM inference workloads

Job description

We’re looking for an architect to own the logical architecture for the A-0 and A-1 wafer products. You will work with the XPU/Compute chip architect and the memory architect to synthesize the final wafer-level architecture.

Ideal Background:

An ideal candidate will have:

• Deep understanding and hands-on experience in the design process of AI chips, such as GPUs, TPUs, XPUs, custom ASICs, etc
• Understanding of memory sub-systems and interactions in multi-die systems
• Understanding of LLM inference workloads, especially at a software level and its implications for hardware (system, package, network, die-level) systems

Strongly Preferred:

• Experience with multi-die designs
• Experience with MCM and chiplet based architectures and architectural partitioning across them
• Experience in partitioning workloads across multiple chips and chip packages