Thermal & Mechanical Packaging Engineer - Data Center

Amazon Inc.; Austin (TX); Hybrid; USD 185,000 - 250,000; Full time

Job summary

Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure.

You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments.

Qualifications

• Master's degree in mechanical engineering or equivalent.
• 5+ years in advanced packaging of semiconductors.
• 10+ years mechanical design of semiconductor systems.

Responsibilities

• Design and build systems for data center hardware from circuit to system level.
• Develop thermal and mechanical packaging solutions for high-volume manufacturing.
• Collaborate with vendors and internal teams to troubleshoot and optimize designs.
• Strive to improve quality, performance and cost of packaging architectures.

Skills

Customer comms

Cross-functional

FEA/CFD tools

Lab experiments

DOE Six Sigma

Education

Master's in Mechanical Engineering

Tools

ANSYS

ABAQUS

COMSOL

FLOTHERM

ICEPACK

Job description

Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure.

You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments.